| Neng Tyi SN03 Perspectives|
fans really do look a lot more deadly than most others. With their 11
fins and squat appearance they end up looking a lot more powerful
than they really
are. While Nidec make excellent fans that last a long
time, this model is only clocked in at 4700 RPM and 16CFM. It
may not seem like a lot of airflow, but I suspect a
lot of other fans from not well known manufacturers are exaggerating
their specs more often then not.
The only real concern with this fan
is the relatively large motor powering the fan blades. It creates one
large dead spot in the centermost fin section, especially as the fan is
mounted only a few millimeters from the copper fins
There are 24 fins in total, each standing
approx. 59mm in height. Each fin is about 0.5mm thick and spaced 2mm
apart. We're a little disappointed to see that the copper fins appear to
be glued to the thick copper base rather thank soldered. It's difficult to tell for sure, but I see no evidence
of solder indicating a sound metallic joint.
The base is 5mm
Except for the flanges from the aluminum shroud which are used to
hold the fan in place the front and back of the SN03 are exactly the same.
The clip proved a bit stiff to engage onto the socket and a screw driver is required
to clip it on.
The base is the 'money' side of any heatsink. While the
Neng Tyi doesn't have the most immaculately finished base it is smooth, and rather uniquely plated. More
then that it is flat where the processor makes contact - so
it can't be all that bad right?
comes with a small patch of
Berquist 200U thermal
interface material pre-applied.
In our tests we found that a good quality
thermal compound works better than the waxy Bergquist
FrostyTech Synthetic Temperature Test Platform:
The FrostyTech Synthetic Temperature Test
Platform consists of an aluminum block heated by a 120V 250 Ohm precision
resistor producing 50W of heat. That heat is transmitted to the heatsink via the
aluminum block and up through special copper die templates with thermistors
embedded directly in them.
A temperature reading for a particular heatsink
is taken once the temperature stabilizes in the copper die template. Since
each of the die templates have the approximate surface area of either a silicon topped
or heatspreader-topped processor the flow of heat to the base of the heatsink
accurately mimics a real life configuration.
| Shown with the copper die template for a silicon-topped
processor, the synthetic heatsink test apparatus awaits a coating of
silver-based thermal compound and the Neng Tyi SN03
heatsink. A slightly larger copper die template was used to test the
effective cooling ability of the SN03 atop a heatspreader-based
processor like an overclocked PGA Celeron processor.