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CuMine Heatsinks - Important Info!
CuMine Heatsinks - Important Info!
Abstract: Coppermine's may fit into a socket 370, and may fit older PPGA heatsinks, but there are compatibility issues. Those issues exist with the heatsink, and the clips they use. Get informed, read this.

 Manufacturer  Category  Published  Author 
intel   Cooling / Heatsinks   Feb 18, 2000   Max Page  

CuMines and heatsinks - what to know

The PIII Coppermine is based upon the FC-PGA form factor. While the CuMine fits in the PPGA-370 socket, it is not compatable unless the socket has been specifically designed for it due to differing voltages and pin-outs between Celerons and CopperMines. A similar situation exists with heatsinks originally designed for PPGA-370 Celerons. In a document released by Intel entitled "Manufacturing with 800Mhz Intel Pentium III (256K) in the FC-PGA Form Factor with reference design" some advice is given to help OEM's deal with heatsink seating problems. We summarize the important bits here, as the document had a lot of extra info only OEM's would be interested in.

The major point to be aware of with the Coppermine is that its thermal and physical properties are different from that of the Celereon. For instance the Coppermine's heatspreader is the back of the silicon die. In the case of the Celeron the silicon die was protected by a slab of copper, and a different amount of surface area was involved.

In terms of the heatsinks used previously to cool Celerons, the part that affects compatibility is the clip. Just about any good heatsink can be used interchangeably between the two processors, but the clips which attach those heatsinks are not compatable. Where Celerons use symmetric clips, Coppermines require asymmetric clips for proper attachment. However asymetric clips have the advantage of working on both Coppermine and Celeron platforms.

An asymmetric heatsink clip is required for the FC-PGA package. An asymmetric clip applies load to the center of the exposed silicon die. A PPGA symmetric clip, which applies load to center of socket body, would place uneven force on the die and tilt the heatsink reducing thermal performance.

Heatsinks designed for the FC-PGA have a portion of the underside of the heatsink cut away to clear the cam of the ZIF socket.

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