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Neng Tyi KA06 Cu-Al Heatsink Review
Neng Tyi KA06 Cu-Al Heatsink Review
Abstract: An outer frame of thicker aluminum plate provides the means for the Nidec fan to be attached and keep the aluminum fins in place. The fins are formed in such a way that they are all interlocked.

 Manufacturer  Category  Published  Author 
Neng Tyi   Cooling / Heatsinks   May 29, 2001   Max Page  

Home > Reviews > Page: Synthetic Test Results:
FrostyTech Synthetic Temperature Test Platform (50W heat load)
Mfg. Name Model No. Ambient Temp. (C) Large block (C) Small block (c) Thermal compound Thermal pad No. Fans Fan Noise Clip
1 Globalwin CAK38 25.2 43.5 45.8 silver goo - 1 high hard
2 Thermoengine V60-4210 25.0 43.9 47.6 AOS52029KY grey 1 low mod
3 Zalman CNPS3100 25.2 54.0 48.0 silver goo none 1 lg low med
4 Blizzard S370 25.2 43.3 48.4 silver goo - 1 med easy
5 Vantec FCE-62540D 24.3 43.6 49.3 AOS52029KY - 1 med-high easy
6 Vantec FCE-6030D 26.2 46.6 50.7 silver goo - 1 high med
7 Thermaltake DU0462-9 mini CuOrb 25.2 48.8 53.0 silver goo - 1 med med
8 Blizzard S370-L 25.8 52.4 54.7 silver goo none 1 low easy
9 Neng Tyi SN03 27.7 45.9 57.2 AOS 52029KY green 1 med stiff
10 cpufx The Core 24.5 47.7 61.7 Silver good - 1 high med
11 Vantec GSW-6015 26.0 48.0 64.2 AOS 52029KY none 1 low easy
12 Neng Tyi KA06 26.0 49.7 70+ AOS 52029KY green 1 mod stiff

For the amount of copper in the KA06 we were a bit surprise to see it perform so poorly. The heatsink failed to make it below the range of out thermal display which max's out at 70 degrees Celsius. Using the AOS non-silicon thermal compound we have in the past been able to knock off a degree or two from the overall temperature rating. Obviously the use of silver-based thermal compound is an even better choice.

Rise Above Ambient Temperature (C)
Mfg. Model with large block with small block
1 Globalwin CAK38 18.3 20.6
2 Thermoengine V60-4210 18.9 22.6
3 Zalman CNPS3100 29.5 22.8
4 Blizzard S370 18.1 23.2
5 Vantec FCE-6030D 20.4 24.5
6 Vantec FCE-62540D 19.3 24.9
7 Thermaltake DU0462-9 mini CuOrb 23.6 27.8
8 Blizzard S370-L 26.6 28.9
9 Neng Tyi SN03 18.2 29.5
10 Coolermaster DP5-6H11 23.3 34.4
11 Vantec GSW-6015 22.0 38.2
12 Neng Tyi KA06 23.7 44.0+

The rise above ambient temperature results show that the Neng Tyi KA06 has some major problems with heat transfer from the thick copper base to the aluminum fins. Our best guess would be that the thermal adhesive used to blond the aluminum fins to the copper is not properly distributed about the entire surface area, or that it is not very thermally conductive. It is interesting to note that the large copper die template is less out of scale than the small copper die template on this range of testing.


The KA06 is listed as being able to handle Intel processors up to 1.13GHz, and AMD chips up to 1.5GHz, but with the temperature performance scores we saw during testing those specs seem a bit out of scale. Perhaps the model we used for out testing was slightly different from the units used to determine those results...

In any regard, the KA06 seems to offer less than ideal temperature performance for its surface area and make-up. The most obvious explanation for this lack of cooling prowess is poor thermal conductivity between the aluminum fins and the copper base plate. Ideally the copper plate should distribute the thermal energy from the core of the processor out towards the edges. It may in fact be doing just that, but if the aluminum fins cannot make proper contact with the copper then that heat energy will not be effectively dispersed to the surrounding environment. Bottom line, the KA06 achieved only average performance.

 Previous Page ° Heat Sink Review Index  

Table of Contents:

 1:  Neng Tyi KA06 Cu-Al Heatsink Review
 2:  Neng Tyi KA06 Perspectives
 3:  FrostyTech Synthetic Temperature Test Platform:
 4: — Synthetic Test Results:

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