Slim form factor liquid cooling technology takes full advantage of the fact that CPUs and GPUs are rarely fully stressed at the same time. The technology interconnects all of the thermal management devices enabling them to dynamically “borrow” idle cooling capacity from one another. In addition, the liquid cooled coldplate has less thermal resistance than a heat pipe. The result is slim form factor liquid cooling technology that can cool much more powerful hardware than is possible with heat pipe based heat sinks.
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