The aluminum fins on this tower heatsink are 0.2mm thick, allowing air to easily pass through the fin stack and consequently keep noise levels in check. The single 140mm PWM fan on the Igloo H58 heatsink rocks out at 1400 RPM full blast, just 700 RPM when dialed back to its most conservative speed. Noise levels flutter between 46.4-31.0 dBA according to Frostytech's real world sound measurements - ie. it's nice and quiet.

Akiba has a couple shots of a LN2 cup for CPU cooling by Reeven. Since when did LN2 overclocking go mainstream?

On the test bench today is Glacialtech's Igloo H58 heatsink - a tower style exposed heatpipe base CPU cooler that marks one of the best efforts by this Taiwan-based thermal solutions manufacturer. The heatsink cools very well on both Intel and AMD platforms as you'll shortly see. The aluminum fins on this tower heatsink are 0.2mm thick, allowing air to easily pass through the fin stack and consequently keep noise levels in check.

Adding to the excitement, another announcement includes a CPU Cooler with a unique honeycomb fin structure, the X6 Elite CPU Cooler. This fin structure is used in conjunction with an angled base that acts as a means to increase overall airflow throughout the chassis. Clever air duct deployment on the outer shell directs airflow to pass over critical cooling areas. X6 Elite also comes equipped with a high performance PWM controlled fan.

X6 Elite will be available for $49.99 USD MSRP at retailers and online locations that carry your favorite Cooler Master products in Q1 2012

Adding to the excitement, another announcement includes a CPU Cooler with a unique honeycomb fin structure, the X6 Elite CPU Cooler. This fin structure is used in conjunction with an angled base that acts as a means to increase overall airflow throughout the chassis. Clever air duct deployment on the outer shell directs airflow to pass over critical cooling areas. X6 Elite also comes equipped with a high performance PWM controlled fan.

X6 Elite will be available for $49.99 USD MSRP at retailers and online locations that carry your favorite Cooler Master products in Q1 2012.

The first ever CPU heatsink to utilize vertical vapor chamber cooling and combine it with heat pipe technology, TPC 812 is prepared to handle the massive heat generated by overclocking and benchmarking. A 100% pure polished copper base combined with improved soldering techniques further increase its thermal transfer capabilities. A special heatsink fin design coupled with an improved fan mounting system and air pressure optimizing design all lend themselves to a collective synergy that makes the TPC 812 best even some all-in-one (AIO) liquid cooling units in testing*. The fan improvements and PWM allow the TPC 812 to silently keep temperatures under control.

TPC 812 will be available** for $69.99 USD MSRP at retailers and online locations that carry your favorite Cooler Master products in Q1 2012. This information is intended for the U.S. and Canada. Price and availability may vary based on region. Please consult your local Cooler Master Representative for more information.

*Results provided for informational purposes only and were achieved through internal testing.
**TPC 812 will come equipped with a 800 – 2400 RPM PWM fan in the U.S. and a 600 – 1600 RPM PWM fan in the E.U.

Dr. Kaveh Azar, president and CEO of Advanced Thermal Solutions, Inc. will be among the industry leaders presenting at the 2012 Smart Lighting conference in Dusseldorf, Germany on January 31 and February 1. Under the subject of Smart Control, Dr. Azar will discuss the impact of excess temperature on the performance, reliability and lifespan of LEDs, and review the many cooling options available.

The heat generated by an LED, and how heat affects the control of an LED’s response time makes cooling a primary concern. Because LEDs are semiconductor devices their light output is directly impacted by temperature. If the thermal situation is not managed it will cause the LED to perform improperly, stop functioning, or shorten its expected lifespan.

The immediate issue is managing LED heat to preserve its performance. How LEDs display colors and how long they can be expected to function puts proper thermal management at the center of their deployment. Across the full temperature range that most lighting is designed for, there is a swing in the relative light output. Each color is affected differently by temperature and the swing in light output is distinctly measureable and visible. This includes the low temperature ranges that are most common to today’s lighting applications.

The challenge facing LED lighting designers is the alignment of the cooling system/solution with the deployment-site requirements and its market acceptance. LED lighting, or correctly stated, solid-state lighting, is identical other electronic devices whose longevity and proper operation directly depend on their junction temperature and how it’s thermally managed. Several cooling technologies for effective LED thermal management are now available and are being deployed across the electronics industry.

Dr. Azar’s presentation will review the details of LED heat transfer that will dictate the selection of the cooling system. The presentation will show cooling options for single or multi-chip LED lights for varied applications, and how to assess their relative effectiveness. 

About the Smart Lighting Conference (www.smartlighting.org)

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