| Sat: 02/04/2012 | Topic: Cooling / Heatsinks PermaLink |
Japanese cooling expert Scythe is expanding its product portfolio by the new Kaze Master Pro Ace fan controller. The built-in technology is based on the already announced Kaze Master Pro 5.25 fan controller, which now comes with classy aluminum front panel design. Hence allows it to match more pc chassis on the market, especially pc chassis with an aluminum front panel.
New Kaze Master Pro Ace fan controller allows users to adjust fan speed of up to fans separately as well as monitoring up to 6 temperature sensors. Adjustments of fan speeds are being made using the 6 potentiometers located in the lower part of the aluminum front panel. Using the other two potentiometers located on the sides, it is possible to choose 2 of the 6 channels to be displayed on the built-in VF-Display (Vacuum Fluorescent Display).
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| Fri: 02/03/2012 | Topic: Cooling / Heatsinks PermaLink |
It's clear from the moment you receive the vast box that Noctua means business with its NH-D14 cooler. The heat sink is comfortably the largest we have tested and the cooler comes with two fans as standard. The question is, does it perform as well as it looks?".
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| Fri: 02/03/2012 | Topic: Cooling / Heatsinks PermaLink |
In this review we will be looking at the new Noctua NF-F12 PWM Fan which features the new Focused Flow technology for better air penetration and overall pressure. The fan features nine major innovations some of which we have seen on competing products with different levels of refinement.
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| Wed: 02/01/2012 | Topic: Cooling / Heatsinks PermaLink |
"When it comes to reviewing products fans just aren’t something very exciting, unless they’re from our friends at Noctua who always seem to be innovating and improving the designs of their fans. They spend quite a bit of time, effort and money on improving fans. Most people take them for granted really. Today for review I’ve got their newest fan called the NF-F12 PWM which is a 120mm fan with lots of new features and it has a very unique look to it. So read on… "
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| Wed: 02/01/2012 | Topic: Cooling / Heatsinks PermaLink |
Curiously, I had a discussion with a thermal solutions manufacturer during
Computex Taipei, circa-2003/04, about nearly the very same concept that Patent 7282799 - 'Thermal interface with a patterned structure' details. That is, to create very thin, shallow grooves in the base of heatsink to enable the maximal amount of excess thermal interface material to escape from between the heatsink-to-integrated heatspreader contact area.
Physics of course gets the original patent on this, as thermal interface
material will naturally do the same thing, given time, heat and clamping force.
You can see examples of this after removing a heatsink, provided the base of the
heatsink is flat and the clamping forces even. If these conditions exist, you'll
see a pattern in the shape of a X going from corner to corner in the
remaining thermal goo, with fine fractal patterns sub-dividing the remaining
area ad infinitum. Patent 7282799: Worth the read.
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| Wed: 02/01/2012 | Topic: Cooling / Heatsinks PermaLink |
"In this study, the heat transfer performance of various commonly used fin geometries is compared. Realistic, manufacturable geometries are considered for minimizing thermal resistance at moderate laminar air velocities and pressure gradients. These consist of plate fins or pin fins, which can be round, elliptical, or square. The plate fins can be continuous (parallel plates) or staggered. The pin fins can be inline or staggered arrays."
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| Tue: 01/31/2012 | Topic: Cooling / Heatsinks PermaLink |
"Since a few years, we have developed experimental benches to visualize the flow in the
capillary structure of FPHPs closed with transparent plates. Different capillary structures have
been studied (grooves with constant or variable widths, crossed grooves, figure 1) for FPHPs
made of copper or silicon. Depending on the applications, we have tested FPHPs with
different sizes and different evaporator, condenser and adiabatic areas."
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| Tue: 01/31/2012 | Topic: Cooling / Heatsinks PermaLink |
Just go here - - and click on the 'Like' button to follow Frostytech on Facebook.
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| Tue: 01/31/2012 | Topic: Cooling / Heatsinks PermaLink |
Some interesting articles on Electronics-cooling relating to heatsinks and thermodynamics - No. 9 was my favourite of last year. Give them a read and educate yourself."
1. THE
SEEBECK COEFFICIENT
Clemens J. M. Lasance
(2006)
This article addresses the Seebeck coefficient, a property that
determines the performance of thermocouples and Peltier elements. Basically, the
Seebeck coefficient is related to the fact that electrons are both carriers of
electricity and heat. If a temperature gradient exists over a piece of
electrically conductive wire, there is a net diffusion of electrons from the hot
end toward the cold end, thereby creating an opposing electric field. In (quasi)
equilibrium this field causes a voltage over the wire, the so-called Seebeck
voltage.
2. HEAT
PIPES FOR ELECTRONICSCOOLING APPLICATIONS
Scott D. Garner, PE
(1996)
Heat pipes have been commercially available since the mid
1960s. Only in the past few years, however, has the electronics industry
embraced heat pipes as reliable, cost-effective solutions for high-end cooling
applications. The purpose of this article is to explain basic heat pipe
operation, review key heat pipe design issues, and to discuss current heat pipe
electronic cooling applications.
3. NOTES
ON USING THERMOCOUPLES
Robert J. Moffat
(1997)
This article discusses thermocouples, the most widely used
temperature sensor in test and development work. Accurate temperature
measurements can be made at low cost with shop-built probes and ordinary
low-level voltmeters.
4. ADVANCES IN
HIGH-PERFORMANCECOOLING FOR ELECTRONICS Clemens J. M. Lasance and Robert E. Simons
(2005)
The need for new cooling techniques is driven by the continuing
increases in power dissipation of electronic parts and systems. In many
instances standard techniques cannot achieve the required cooling performance
due to physical limitations in heat transfer capabilities. These limitations are
principally related to the limited thermal conductivity of air for convection
and copper for conduction.
5. SIMPLIFIED FORMULA FOR ESTIMATINGNATURAL CONVECTION HEAT
TRANSFERCOEFFICIENT ON A FLAT PLATE
Robert E. Simons
(2001)
Natural convection cooling combined with radiation is what
results when a fan is not used in the cooling design to move air. Instead,
movement of the air is induced by density differences resulting from the heat
dissipated by the electronic components. An obvious advantage of natural
convection, or "free" convection as it is sometimes called, is that the expense
of incorporating a fan is avoided. Of course the penalty associated with this
method of cooling is lower heat transfer coefficients.
6.
ALL YOU NEED
TO KNOW ABOUT FANS
Mike
Turner (1996)
Fans can be thought of as low pressure air pumps that utilize
power from a motor to output a volumetric flow of air at a given pressure. A
propeller converts torque from the motor to increase static pressure across the
fan rotor and to increase the kinetic energy of the air particles. The motors
are typically permanent split capacitor AC induction motors or brushless DC
motors. This article looks at this system in more
detail.
7. IN THE
DATA CENTER, POWER ANDCOOLING COSTS MORE THAN THE ITEQUIPMENT IT
SUPPORTS
Christian L. Belady, P.E.
(2007)
Historically, the cost of energy and the cost of the data
center power and cooling infrastructure have not been on the radar for most
Chief Financial Officers (CFO) and Chief Information Officers (CIO) and have not
been considered in TCO (Total Cost of Ownership) models. As a result, almost all
of the focus has been on driving down the cost of IT equipment in the data
center. This was a reasonable assumption during the 90’s when server power and
energy costs were substantially lower. However, power density has been
increasing at an alarming rate. During this same period of rapid power growth,
server costs have stayed virtually flat and raw performance has increased
substantially.
8. ESTIMATING PARALLEL PLATE-FINHEAT SINK THERMAL
RESISTANCE
Robert E. Simons
(2003)
The trend of increasing electronic module power is making it more and more
difficult to cool electronic packages with air. As a result there are an
increasing number of applications that require the use of forced convection
air-cooled heat sinks to control module
temperature.
9. THERMAL CONDUCTIVITY OF SOLDERS
Jim
Wilson (2006)
Soldering has been a primary method of establishing mechanical and electrical
connections in electronics for many years and will likely be used in this
fashion in the future. While there are several physical properties and
characteristics of solders that are of interest to the electronics community at
large, one of the most significant physical properties to a thermal engineer is
thermal conductivity.
10. HOW
TO SELECT A HEAT SINK
Seri
Lee (1995)
With the increase in heat dissipation from microelectronics devices and the
reduction in overall form factors, thermal management becomes a more important
element of electronic product design.
11. AN
INTRODUCTION TOTHERMOELECTRIC COOLERS
Sara
Godfrey (1996)
Thermoelectric coolers are solid state heat pumps used in applications where
temperature stabilization, temperature cycling, or cooling below ambient are
required. There are many products using thermoelectric coolers. This article
discusses the theory behind the thermoelectric cooler, along with the thermal
and electrical parameters involved. "
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| Tue: 01/31/2012 | Topic: Cooling / Heatsinks PermaLink |
Scythe Co. Ltd. extends the popular Gentle Typhoon fan series by three powerful high RPM models. The new Gentle Typhoon High RPM fans are available with 3.000, 4.250 and 5.400 rpm. These high fan speeds generate an incredible airflow of 141, 197 and 255 m³ per hour (83.0 / 116.5 / 150.1 CFM).
In direct comparison to fans with similar specs, the Gentle Typhoon High RPM series scores with a significant lower noise. Like the normal GT models, a perfectly balanced Nidec Servo bearing is used, ensuring an average MTBF of 100.000 hours. The reliable motor operates with an almost fluctuation-free rotational torque. Vibrations transferred from the motor to the venturi (fan case) are reduced to a minimum.
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| Tue: 01/31/2012 | Topic: Cooling / Heatsinks PermaLink |
ARCTIC is proud to release its new VGA cooler - the Accelero Xtreme 7970, which is compatible with the world’s first 28nm GPUs. This VGA cooler is mainly designed to fit the AMD 7900/7800 series graphic cards. It is equipped with a 92 mm ultra-quiet PWM fan and five heatpipes which provide an optimal cooling capacity of up to 300 Watts with inaudible operation.
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| Mon: 01/30/2012 | Topic: Cooling / Heatsinks PermaLink |
Japanese cooling expert Scythe has today announced a new Screw Kit for upgrades to socket LGA2011. Thanks to this new Scythe Screw Kit for Intel LGA 2011 users are able to upgrade new as well as older Scythe CPU Coolers to achieve compatibility to the recently announced enthusiast platform based on socket LGA2011. It is possible to use the new Screw Kit with the CPU Coolers Mugen 3, Mine 2, Ninja 3, Susanoo, Mugen 2 Rev.B and Big Shuriken 2 to upgrade and establish compatibility. Required screws, wrench and manual are contained in the package of the Screw Kit.
Mentioned CPU Coolers are usually mounted with a Scythe backplate designed for various sockets. Socket LGA2011 mainboards are already equipped with an own pre-mounted backplate which is firmly connected to the socket. Scythe Screw Kit for Intel LGA 2011 is utilizing this backplate and achieves a solid as well safe mounting between socket LGA2011 and the Scythe CPU Cooler. Installation still requires the Metal Assembly Clips for socket LGA775, 1155, 1156, 1366 which are delivered with the mentioned CPU Coolers.
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| Fri: 01/27/2012 | Topic: Cooling / Heatsinks PermaLink |
"To sum it all up, Cooler Master's new Hyper 212 Evo CPU cooler has great performance, yet leaves a relatively small acoustic footprint. The included mounting solution is very robust, if a bit fussy to install, and Cooler Master includes an extra pair of fan clips should the user wish to add another fan."
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| Fri: 01/27/2012 | Topic: Cooling / Heatsinks PermaLink |
"The Prolimatech Lynx is a smaller version of the Panther CPU cooler that we tested recently. It has a small, lightweight tower heatsink with three heatpipes and comes with one 120 mm fan."
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| Fri: 01/27/2012 | Topic: Cooling / Heatsinks PermaLink |
On the test bench today is Glacialtech's Igloo H58 heatsink - a tower style exposed heatpipe base CPU cooler that marks one of the best efforts by this Taiwan-based thermal solutions manufacturer. The heatsink cools very well on both Intel and AMD platforms as you'll shortly see.
The aluminum fins on this tower heatsink are 0.2mm thick, allowing air to easily pass through the fin stack and consequently keep noise levels in check. The single 140mm PWM fan on the Igloo H58 heatsink rocks out at 1400 RPM full blast, just 700 RPM when dialed back to its most conservative speed. Noise levels flutter between 46.4-31.0 dBA according to Frostytech's real world sound measurements - ie. it's nice and quiet.
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| Fri: 01/27/2012 | Topic: Cooling / Heatsinks PermaLink |
"Cooler Master's GeminII range offer top down cooling designs, with the S524 the newest edition. Compatible with 120mm and 140mm fans it can offer an upgrade for your processor cooling - and your whole system."
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| Thu: 01/26/2012 | Topic: Cooling / Heatsinks PermaLink |
The evolutionary Hyper 212 model now boasts new base with improved heatpipes direct-touch technology and a new fan. The cooler has also become a little pricier. Let’s find out how successful these improvements turned out to be.
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Can a well-known cooling product manufacturer roll out a good SSD? Yes, he can, because the second generation SandForce platform paved a very short route to the SSD market for those interested.
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| Wed: 01/25/2012 | Topic: Cooling / Heatsinks PermaLink |
The Cooler Master Hyper 412 PWM takes the idea of direct contact a step further by using what they term “C.D.C.” Heat Pipes. “C.D.C.” in the Cooler Master Hyper 412 PWM stands for “Continuous Direct Contact”, and refers to four reshaped heat pipes which allow them to be placed with no gaps between. The heat pipes transform to a half circle in the contact area, and laid side by side allow for a smooth, even coverage on the CPU’s hot spots, all with direct heat pipe contact. In addition, the Hyper 412 PWM offers airflow refinements using a 120mm fan with variable speeds from 600-2000rpm controlled by PWM, and is dual fan capable with hardware for the second fan included."
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| Wed: 01/25/2012 | Topic: Cooling / Heatsinks PermaLink |
"The Cooler Master Hyper 212 EVO is a mid-priced tower cooler for budget minded enthusiasts looking for a solid performing and good looking replacement for their stock cooler. Using Intel's X58 Core i7 platform as a heat load, we test it in single and dual fan configuration."
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