| 360° View - Intel Stock Pentium D
Information on Frostytech's test
methodology is available here.
||The Heatsink Fan: |
Intel Pentium D heatsink is built with an 84mm diameter fan that spins at
speeds an est. 800-2600RPM. The speed of the seven-bladed Pulse Width
Modulation (PWM) Nidec fan is controlled via the BIOS. Power is supplied by the
4-pin PWM fan cable which connects to a standard 3-pin or 4-pin
motherboard fan header. As with most Intel reference LGA775 heatsinks,
the fan is suspended 2mm above the cooling fins, without a complete
fan guard. The plastic motor supports offer some marginal protection from errant wires being drawn
into the impeller, but it's best to ensure cables are kept tidy inside the PC.
With the fan support structure removed, the
unique design of Intel's stock Pentium D heatsink is clearly
visible. The central copper core is 13mm thick at the
base, then the remaining 22mm deep cavity opens up so there is
just 3mm of copper along either edge. The aluminum 'donut' measures
87mm in diameter, though each side is comprised of 2mm of aluminum and
~21mm of aluminum cooling fin. Each aluminum cooling fin is 0.6mm thick
and spaced 0.8mm at the base, 1.7mm at the tip.
The body of the stock Intel Pentium D heatsink stands exactly 30mm tall, with
an overall height of 72mm. The plastic clips lock directly into the 4mm
motherboard mounting holes which surround the LGA775 processor socket. To release
the heatsink from the board, the upper portion of the clip is rotated 90
degrees and pulled upwards. The heatsink then pulls free of the board.
Heatsink Side B:
The fan support frame locks onto the aluminum portion of the heatsink with a couple slashes
cut into the side of the fins. The fan frame is held in tension, so vibration and rattling shouldn't
be an issue. Air is exhausted outwards from the cooling fins, where it can then be used to cool
adjacent board-mounted components.
The copper base of the stock Intel Pentium D
heatsink is 35mm in diameter where it makes contact with the processors' integrated
heatspreader (IHS). The heatsink ships with a thin grey pad of ShinEtsu thermal interface
material pre-applied. The copper is machined perfectly flat, and is smooth. Surface roughness is on the order of ~8 microinches, which is considered
excellent. Owing to the pinless design of the LGA775 processor and socket, the
mounting clips and hardware on the heatsink are actually rigid mounts. It's the
CPU in the socket which provides the tension to the equation, by means of
its many springy electrical contacts.