Thermal Integration brought the overclocking world
the original Thermoengine heatsink , and the company has
yet to abate when it comes to ingenuitive cooling solutions. FrostyTech caught
up with Thermal Integration at its booth during a recent Computex for a look at
some new heatsinks the company is producing.
interesting piece of hardware on display is the AMD socket 754/939 test bed, a
slab of PCB with socket and connections for thermally testing heatsinks for the
Athlon64 platform. According to AMD documentation in the AMD Thermal Design Guidelines, this apparatus is also
used with load cells to measure the clipping force applied by the processor
heatsink. The Athlon64 guidelines require a heatsink which applies upwards of
75lbs pressure on the heat spreader; which explains why it is crucial to use the
back stiffener plate to ensure there is no PCB warping.
several shapes and applications were on display by Thermal Integrations at this
particular event, including a 1U server configuration. The large red 'octopus'
heatpipe system is configured for a Xeon processor in this example. The unit is
a prototype for demonstrating Thermal Integration's manufacturing capabilities,
it is not commercially available.
heatpipe based units on the left are configured for what will eventually become
socket 478 heatsinks, the rather large heatsink on the right could be useful for
a small formfactor computer where the heat exchanging fins are passively cooled
outside of the outside of the SFF case. So far, we have not seen any production
ready units available from Thermal Integration.
Pentium 4 and TI-A8641L AMD AthlonXP heatsink on the left are each made from a
bundle of punched out sheets of thin copper or aluminum metal. Both heatsinks
are currently available from Thermal Integration, and in testing have proved to
be very capable coolers. A internal triangular-shaped base design is used in the
Pentium 4 heatsink in an effort to improve performance levels.
Background: Established in 2H 2001, Thermal Integration
Technology Inc. (T.I.T.I.) is a professional thermal solution provider. By
offering wide range of thermal products, T.I.T.I. fulfills the strict
requirement on thermal solution for both computing and IA industries. The
elite staffs from respective fields, T.I.T.I. continuously introduce more
value-added products to market. We strive to be the customer oriented
thermal solution provider.|
|Further Info: Heatsink Industry Directory - General Heatsink Mfg'r Web