Thermaltake's Jungle 512 socket
775 heatsink looks like it
packs a pretty heavy punch.... but does it really? It's monsterous 92mm
PWM fan draws upwards of 1.0Amp at full speed, and its red fan blades spin
with enough force to take a big chunk out of careless fingers
too. Below the big fan is a circular
array of bifurcated aluminum fins, and at the Jungle 512's heart a large
copper slug; all fairly standard stuff for an Intel socket 775 heatsink.
In fact
the Thermaltake Jungle 512 is one of many heatsinks based almost entirely
on Intel's reference RCBFH-3 heatsink design. After developing the Radial
Curved Bifurcated Fin Heatsink (RCBFH-3) thermal solution for
itself, the design has flourished. Almost every single heatsink manufacturer has
at least one cooler based upon it.
The Intel
'Prescott FMB2' compliant Thermaltake Jungle 512 heatsink is equipped with a
32x92x92mm 4-pin PWM fan that rotates at between 2300 and 3600RPM. When
installed on a PWM fan compatible socket 775 motherboard, this finger
chopping fan scales its speed to meet the immediate thermal demands of
the processor, without creating too much unnecessary noise. We tested the Jungle
512 with a standard 3-pin fan power supply, and in that instance the
fan defaults to its lower speed of 2300RPM. That's good enough for adequate
cooling, but not any better than the stock Intel
Pentium D heatsink can dish
out.
The 560g
Thermaltake Jungle 512 heatsink
installs onto any socket 775 motherboard via Intel's plastic push-to-click,
turn-to-release retention clips. No tools are needed.
Thermaltake Jungle 512 Heatsink
|
 | |
 |
| HEATSINK SPECSHEET |
| Manufacturer: Thermaltake |
| Model No.: Jungle 512 (CL-P0037) |
| Materials: Extruded aluminum, copper insert. |
| Fan Mfg: Everflow F129032BUT |
| Fan Spec: 2300-3600RPM, 12V, 1.00A |
| Fan Dim: 32x92x92mm |
| Heatsink & Fan Dim: 89x97x97mm |
| Weight: est. 560 grams |
| Includes: thermal compound. |
Compatible with Sockets: LGA775 |
| Est. Pricing: $30USD
($35CDN) | |
The Thermaltake Jungle 512 heatsink is composed of two
sections - the first is an outer 90mm diameter cylinder of extruded
aluminum cooling fins, the second is an internal 34mm diameter cylindrical copper slug.
The copper slug makes direct contact with the surface of the LGA775
processor.
The
copper transfers heat energy from the CPU, and increases the total surface
area of the heat source before transferring the heat energy to the 40mm high
aluminum component.
As you know, surface area is key to achieving an
efficient thermal solution. The more cool air you can pass over a surface of a
given size, the more heat you can remove into the surrounding
environment. This is where the radially
curved bifurcated aluminum fins come into play; compared to a standard fin they have about 1.5x
the surface area. Bifurcated simply means "to divide or fork into two branches,"
and that is exactly what the fins look like.
FrostyTech's heatsink test methodology is outlined in detail here if you care to know what equipment is
used, and the parameters under which the tests are conducted. Now let's move
forward and take a closer look at this heatsink, its acoustic characteristics,
and of course it performance in the thermal tests!
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