Thermaltake will offer competent enthusiasts a free set of cooler mounting kits to hold up the Intel upcoming LGA-2011 socket, to facilitate our dedication to the corporate mission of “delivering the perfect user experience,” as well as show our appreciation to the Thermaltake brand supporters.
The LGA-2011 upgrade mounting hardware will be provided free of charge to anyone who has purchased a qualified cooler prior to October 2011.
Intel® LGA-2011 compatible and Qualified Cooler:
* Thermaltake Bigwater 760 Plus
* Thermaltake Frio OCK
* Thermaltake Frio
Among various physical attribute changes, the most notable difference is that there are no “pass-through” holes for the mounting mechanism. On the LGA-1155/1156 and LGA-1366 motherboard, the mounting retention would pass through the motherboard and be retained by either plastic push pins or a variation of backplate and mounting screw combination depending upon the cooler used. With the LGA-2011 socket, the main load mechanism to retain the CPU in the socket also has threaded tabs which are where the cooler will be mounted. This will require a change to present cooler mounting for compatibility and Thermaltake has a solution to ensure enthusiasts can upgrade to this socket with just a minor hardware change.