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Diamond-Copper Thermal Ground Plane Heatsinks - Diamond-Copper Thermal Ground Plane Heatsinks
Fri Dec 31, 2010 | 8:33P| PermaLink
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"This new-fangled material is a composite of diamond and copper and a part of new concept called a “Thermal Ground Plane.”

This material is being developed in collaboration with Raytheon and DARPA. They are aiming to raise thermal conductivity capabilities of this material to 20,000 watts per meter Kelvin which is very high considering that present thermal conductivity of ideal material, copper, is 200 to 300 watts per meter Kelvin.

"A Thermal Ground Plane is basically a materials system," Nadler explained. "The most thermally conductive natural material, pure diamond, has a conductivity of about 2,000 watts per meter Kelvin. We're aiming for 20,000, and to do that we have to look at the problem from a materials systems standpoint."


ATI Radeon HD 5570 Review - ATI Radeon HD 5570 Review
Tue Feb 09, 2010 | 3:49A| PermaLink
It's self-evident how AMD has kept us busy over the last few months, showing us new generation GPUs aiming at all possible price points. From the performance-oriented HD 5850/5870, to the mainstream HD 5770 and the extreme dual-GPU powered HD 5970. The budget models had to wait a bit longer. Today AMD is introducing another new member to the Radeon HD 5000 family -- the eighth installment in the series. The ATI Radeon HD 5570 will sit between the aforementioned Radeon HD 5450 and 5670 in terms of pricing and performance, which means it should deliver a similar level of performance to that of the Radeon HD 4670 at the same starting price of ~$79. The Radeon HD 5570 is a more powerful GPU than the HD 5450, capable of playing games comfortably at 720p while retaining some of the HTPC-friendly properties that made the latter an attractive buy.

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