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"This new-fangled material is a composite of diamond and copper and a part of new concept called a “Thermal Ground Plane.”
This material is being developed in collaboration with Raytheon and DARPA. They are aiming to raise thermal conductivity capabilities of this material to 20,000 watts per meter Kelvin which is very high considering that present thermal conductivity of ideal material, copper, is 200 to 300 watts per meter Kelvin.
"A Thermal Ground Plane is basically a materials system," Nadler explained. "The most thermally conductive natural material, pure diamond, has a conductivity of about 2,000 watts per meter Kelvin. We're aiming for 20,000, and to do that we have to look at the problem from a materials systems standpoint."