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Raytheon Thermal Management Using Diamond  - FrostyTech.com Raytheon Thermal Management Using Diamond
Mon Dec 27, 2010 | 8:11A| PermaLink
www.frostytech.com

"Diamond microchannel heat sink. The sink (dark area) is soldered to a supporting, diamond 'strongback'. Its performance exceeds that of all other microchannel heat sinks described in literature."

The microchannel heat sink was invented by Tuckerman, who, as a graduate student at Stanford in the early '80s, foresaw that power dissipated by Silicon-based processors would one day be so great as to prohibit conducting heat to distant heat sinks. He proposed that very narrow channels (micro-channels) for coolant be etched into the chip's rearface, and demonstrated the tremendous thermal performance to be realized by such an approach. Now, two decades later, microchannels are at the leading edge of thermal control technology. And, the best microchannel ever (as far as we know) was produced in Lexington, using Raytheon's home-grown diamond.

FULL STORY @ RELIABILITYANALYSISLAB
(https://www.reliabilityanalysislab.com/tl_cw_0309_ThermalManagement.html)

Intel Core i3 530 and i3 540 - FrostyTech.com Intel Core i3 530 and i3 540
Wed Feb 24, 2010 | 9:03A| PermaLink
After the imbalanced and overpriced Core i5 600 series Intel is making yet another step to deliver their Westmere architecture to the average user via Core i3 processors. Packed with Hyper Threading with lower frequencies and no Turbo Boost compared to i5 600 models, Core i3 530 and 540 got a tough task replacing Core 2 E7x00/E8x00 and put some pressure on AMD's cheap quad and triple core processors.
FULL STORY @ TECHPOWERUP
(http://www.techpowerup.com/reviews/Intel/Core_i3_540_530)


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