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Thermal Ground Plane Conductive Material  - Thermal Ground Plane Conductive Material
Mon Dec 27, 2010 | 7:07A| PermaLink
"Georgia Tech researchers are working on a new novel material for cooling high-powered electronics. Developed in conjunction with Raytheon and DARPA, the material is a composite of copper and diamond, two of the most effective heat-conducting materials. The composite would serve as part of a sandwich of cooling materials called a Thermal Ground Plane.

Right now, the most high-end copper conductors have a heat conductivity efficiency rating of 200 to 300 watts per meter Kelvin. This new material could potentially have a rating as high as 20,000 watts per meter Kelvin.

Because diamond and copper don't bond together particularly well, researchers are still working on designs to create an effective final material, but they're confident their concept will come to fruition."


Sapphire Radeon HD 5570 - Sapphire Radeon HD 5570
Thu Feb 25, 2010 | 9:00A| PermaLink
During the launch some days ago, it became quite clear that AMDs reference design for the Radeon HD 5570 will be altered by the OEMs for their own products. How the individual products could look like, shows with a model from Sapphire.

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