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Spire TherMax II SP679S1-PCI CPU Cooler Review  - FrostyTech.com Spire TherMax II SP679S1-PCI CPU Cooler Review
Thu Nov 04, 2010 | 1:52P| PermaLink
"This test looks at Spires current flagship CPU cooler area, the TherMax II SP679S1 PCI universal. Dieser für alle gängigen Sockel geeignete Universalkühler wird es in unserem Testsystem nicht leicht haben. This universal base suitable for all standard cooler is not in our test system easy to use. Wir stellten dem Kühler keinen geringeren als den aktuellen Phenom II X6 1055T zur Seite. We put the cooler no less than the current Phenom II X6 1055T aside. Dieser hat eine TDP (maximale thermische Verlustleistung) von 125 Watt bei Standardspannung und sollte dem TherMax II ordentlich einheizen. This has a TDP (thermal maximum power dissipation) of 125 watts at standard voltage, and should the TherMax II einheizen properly. Ob das Konzept mit den direkt auf der DIE des Prozessors aufliegenden Heatpipes aufgeht, soll der Test im Folgenden näher erörtern. Whether the concept works with the processor directly to the THE resting heat pipes, to the test in the following discuss in more detail. TecCentral.de wünscht viel Spass beim Durchlesen! TecCentral.de wishes have fun reading!"
FULL STORY @ UNIVERSAL
(http://www.teccentral.de/forum/reviews-tests-artikel-ratgeber-f305/spire-thermax-ii-sp679s1-pci-universal-cpu-kuehler-77289.html#post592349)

Host controller vendors eyeing USB 3.0 market in 2010 - FrostyTech.com Host controller vendors eyeing USB 3.0 market in 2010
Mon Mar 29, 2010 | 3:27P| PermaLink
USB controller design houses including ASMedia Technology, JMicron Technology and VIA Labs are all eyeing the growing USB 3.0 and SATA 3.0 controller solution market in 2010. The players expect global shipments of USB 3.0 host controller chips alone to top 20 million units this year.
FULL STORY @ DIGITIMES
(http://www.digitimes.com/NewsShow/MailHome.asp?datePublish=2010/3/26&pages=PD&seq=217)


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