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Methods for dissipating heat from Circuit Boards - FrostyTech.com Methods for dissipating heat from Circuit Boards
Thu Sep 02, 2010 | 12:02A| PermaLink
www.frostytech.com
"In many cases, mounting of a heat sink over the full board area is not necessary or practical, for example, when the RF circuit board has yet to be mounted on a metal holder or in a metal housing. A local heat sink integrated in the RF circuit board will then suffice to transfer heat away from the component to the underside of the circuit board and then to an external heat sink.

For example, areas with thermal vias can dissipate the heat through the circuit board. If their thermal conductivity is not high enough, pieces of solid copper (Cu coins) are inserted in the circuit board. Copper has high electrical and thermal conductivity properties and can be readily integrated into circuit board designs.

method is to embed the copper pieces in an RF multilayer circuit board. High-frequency circuits are often stacked up to form a so-called hybrid design."

FULL STORY @ EVERTIQ
(http://www.evertiq.com/news/14985)

Larrabee instruction emulation layer - FrostyTech.com Larrabee instruction emulation layer
Wed May 27, 2009 | 4:02P| PermaLink
"It is important to note that this does NOT mean Larrabee hardware is also going to find its way to these developers hands yet; the software is essentially a Larrabee emulator that compiles and "runs" the code on the primary system CPU. The current setup will allow developers to start playing with as much as a 16-wide SIMD and to see how the programming model for Larrabee is similar to, and differs, from traditional x86 programming."
FULL STORY @ PCPER
(http://www.pcper.com/article.php?aid=683)


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