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SilenX EFZ-80HA2 Heatsink
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| Tue Aug 31, 2010 | 5:15P| PermaLink |
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"Equipped with an 80mm 'SilenX Effizio Series Quiet Fan', the SilenX EFZ-80HA2 heatsink makes for one compact little cooler, a heatsink small enough to use in a Media PC or compact computer enclosure. The heatsink is all but tiny compared to many of today's tower heatsinks, which is good because there aren't that many small CPU coolers to choose from anymore. Most remarkably though, the EFZ-80HA2 uses only two 6mm diameter copper heatpipes!"
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FULL STORY @
FROSTYTECH (http://www.frostytech.com/articleview.cfm?articleID=2539)
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VIA Delivers Stunning Hi-Def Video and DX10.1 to Pico-ITXe
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| Thu May 28, 2009 | 4:01P| PermaLink |
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VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the first expansion HD module for the VIA EPIA-P710, the VIA P710-HD. Featuring the powerful 4300E embedded graphics processor from S3 Graphics, this first Pico-I/O module for stackable Pico-ITXe boards delivers Hi-Def™ video playback and advanced graphics in an extremely low power, compact form factor.
With multiple display support including dual DVI and HDMI, the VIA P710-HD module opens up a new realm of possibilities to system integrators of multimedia intensive embedded applications. Sophisticated digital signage, arcade gaming, kiosk and POI applications can now take advantage of multiple digital display configurations and cutting edge Hi-Def playback of resolutions up to and beyond 1080p.
Supporting connectors based on the SUMIT™ specification, the VIA P710-HD module can be used with the VIA EPIA-P710, the first board to take advantage of the new Pico-ITXe standard and SUMIT™ connector specifications.
“VIA is again placing itself ahead of the competition in bringing to market all the benefits of high-definition visual computing in an ultra-low power, ultra compact product,” said Daniel Wu, Vice President of VIA Embedded, VIA Technologies, Inc. “The VIA P710-HD module, when paired with a Pico-ITXe board, opens up a new world of digital brilliance.”
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FULL STORY @
VIA.COM (http://www.via.com.tw/en/company/events/esc2009/index.jsp)
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