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Heat Conducting Graphene Could Cool Electronics - Heat Conducting Graphene Could Cool Electronics
Tue Jun 08, 2010 | 12:54P| PermaLink
"Multiple layers of graphene show strong heat conducting properties that can be harnessed in removing dissipated heat from electronic devices, a team of scientists from the University of California reported in a recently published paper in the journal Nature Materials. Having previously shown that graphene — a two-dimensional layer of carbon atoms packed in a honeycomb structure — behaves as a strong heat conductor, the group tested a solution in which multiple sheets of graphene embedded within silicon chips can dramatically improve the thermal characteristics, meaning lower temperatures and a concrete possibility for chip manufacturers to reach higher processing speeds with relative ease."

AMA Aragon 900 - AMA Aragon 900
Thu Jun 04, 2009 | 6:07P| PermaLink
"The introduction of the latest Intel i7 processors have certainly caused something of a shock with a TDP of a whopping 130W. Air cooling solutions have been adapted with dual fans, bigger heatsinks, and more heatpipes in order to try and keep the all important CPU cool. With Intel now revealing two new additions to the i7 range – the 975 and 950 – which run at 3.33GHz and 3.06GHz respectively even more emphasis has been placed on cooling. Traditionally, air cooling is the lowest form of cooling followed by water, then phase changing and all the way up to liquid nitrogen and helium for extreme overclockers; without a doubt all of this and more will be put into practise at the Gigabyte Open Overclocking Championships (GOOC 2009) at Computex to see who can overclock the P45 the furthest, 8GHz is the current world record.

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