The Danamics LM10 heatsink is a liquid metal based CPU cooler produced by Danamics ApS in Nørresundby, Denmark. The heatsink has what appears to be five heatpipes connecting a base plate to a small black box and standard array of aluminum cooling fins. In actuality, these are a series of pipes connecting an electromagnetic pump which drives a liquid metal fluid through the heatsink to efficiently conduct heat from the CPU to cooling fins. A standard 120mm/90mm fan exhausts the heat into the surrounding environment in the conventional manner.
Electromagnetic pumps contains no moving parts, are silent and suffer no performance degrading over time. The Danamics design uses a "multi-string electromagnetic pump" with
unspecified flow. The liquid metal is most likely an alloy of Gallium, Indium, Tin, Bismuth and perhaps even Mercury. The resulting amalgam has a very low melting temperature of perhaps 10-20C.
Several examples of this technology exist from which we can infer design parameters. (ie. Patent 62118000, 361700000)
Intel acquired a patent for an electromagnetic pump driven system in 2005 that sounds identical in principle to the Danamics approach. Patent application 11/322495 'Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewals' outlines the
idea in painstaking detail.
The Danamics LM10 Intel & AMD heatsink has no bulky external
housings, reservoirs or radiator. The LM10 heatsink is a self-contained
unit consisting of a hermetically sealed electromagnetic "multi-string"
pump (drawing less than 1W), cooling fins and base block. The pump has
no moving parts and is orientation independent.
You may recall Sapphire's never-ever-made-it-to-retail liquid metal
cooled videocard also used a liquid metal