"Prof. LIU Jing with the CAS Technical Institute of Physics and Chemistry in Beijing has developed a novel liquid metal cooling system that can be powered by the heat produced by computer chips. The feat was reported by the UK Journal of Physics D: Applied Physics as a cover article.
Liquid metal with a low melting point was already established as the most conductive coolant for efficiently cooling the computer chip. By making full use of the double merits of the liquid metal, i.e. superior heat transfer performance and electromagnetically drivable ability, Prof. Liu and his colleagues have demonstrated, for the first time in the world, the liquid-cooling concept for the thermal management of a computer chip using waste heat to power the thermoelectric generator (TEG) and thus the flow of the liquid metal."
FULL STORY @ ENGLISH.CAS (http://english.cas.cn/eng2003/news/detailnewsb.asp?InfoNo=27046)
