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CT Electronics Multiwick Vapor Chamber Heatsinks - FrostyTech.com CT Electronics Multiwick Vapor Chamber Heatsinks
Fri Sep 26, 2008 | 3:56P| PermaLink
www.frostytech.com
The Desktop Series was designed for both Intel and AMD processors in desktop computers. Through Vaportek technologies, the thermal performance is achieved to be 3X of ordinary P4 heatsink. It is light-weight, user-friendly and orientation-free for different chassis design.

Weight: 485g
Size: 91mm x 71mm x 62mm
Theta-sa: 0.135 °C/W @ ~65cfm
Theta-cs: 0.05 °C/W ( using Shin-Etsu thermal interface material)
Theta-ca: 0.185 °C/W @ ~65cfm
Materials: Copper (C1100), Aluminum (A1 1100) and Water

www.frostytech.com
The BTX Type-II Series was designed according to the Intel BTX specifications. Through Vaportek technologies, this product can maintain the CPU its required temperature while requiring a minimal flat rate of 20cfm.

Weight: 450g
Size: 92mm x 89mm x 50mm
Theta-sa: 0.257 °C/W @ ~20cfm
Theta-cs: 0.042 °C/W ( using Shin-Etsu thermal interface material)
Theta-ca: 0.299 °C/W @ ~20cfm
Materials: Copper (C1100), Aluminum (A1 1100) and Water

www.frostytech.com
The Graphic Card Series was designed for the graphic card market. Through Vaportek technologies, this product can achieve a significantly reduction in size and weight while all sustain a heat dissipation of 200W.

Weight: 240g
Size: 85mm x 60mm x 33mm
Theta-sa: 0.20 °C/W @ ~24cfm
Theta-cs: 0.05 °C/W ( using Shin-Etsu thermal interface material)
Theta-ca: 0.25 °C/W @ ~24cfm
Materials: Copper (C1100), Aluminum (A1 1100) and Water

FULL STORY @ CT SOLUTIONS LIMITED
(http://www.cte.ctl-intl.com)


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