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Metafoam's Boiling Surfaces Can Manage Heat Loads Close to 500Watts  - FrostyTech.com Metafoam's Boiling Surfaces Can Manage Heat Loads Close to 500Watts
Fri Feb 01, 2008 | 5:21P| PermaLink
PCSTATS.com
Metafoam Technologies Inc. is proud to announce that its latest generation of boiling surfaces, Vapore, is reaching new heights. Latest results reveal that Metafoam's boiling surfaces, based on its metal foam technological platform, can handle heat fluxes up to 76 watts per square centimeter, meaning close to 500 watts for a standard processor die.  "This new generation of pool boiling surfaces allows the Company to consolidate its position in the thermal management of high powered electronics", according to Dominic Pilon, Metafoam's Founder and Chief Technology Officer. Vapore technology can be used in thermosyphons, namely for servers and defense applications but also in HVAC systems.
FULL STORY @ METAFOAM
(http://www.metafoam.com/News_500W.html)


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