The HP BladeSystem c-Class uses up to 27 percent less power than the IBM
BladeCenter-H in similar configurations that reflect real-world customer usage
of blade server environments. The results derive from a week-long study
conducted by Sine Nomine Associates of Ashburn, Va., which examined the overall
power consumption and external airflow requirements of a variety of blade server
and 1U rack server configurations in a typical data center environment
experiencing light to heavy use.
The documented and publicly available results demonstrate that the HP
BladeSystem c-Class and its zoned cooling properties not only lower power usage
through efficient power distribution but also optimize airflow, which is a
significant component in keeping data centers cool. In fact, the benchmark study
shows the HP BladeSystem c-Class requires 60 percent less airflow than the IBM
HP, the new industry leader in factory revenues and units shipped for blade
servers,(2) features HP Thermal Logic technology in its BladeSystem enclosure to
offer customers reduced power and cooling loads right out of the box.
“Power and cooling are serious issues for customers,” said Mark Potter, vice
president, BladeSystem Division, HP. “Sine Nomine took an objective look at this
real-world customer problem and the test results show what we already knew: HP
BladeSystem c-Class featuring Thermal Logic is the clear choice for customers
addressing their power and cooling challenges.”
Recent industry studies reveal that data center power density has increased
more than tenfold in the last 10 years and that, in some cases, cooling
represents upwards of 70 percent of the total data center power spend for
customers.(3) These costs are driven by the data center power requirements and
the cubic feet per minute of cooling airflow.
While some vendors focus on single aspects of the data center power and
cooling problem, HP takes a holistic approach to synchronize power efficiency
across multiple elements. Systems taking advantage of this approach include the
HP BladeSystem c-Class and the recently announced data center-wide HP Dynamic
Smart Cooling solution.
Additionally, HP has a large patent portfolio covering advances in power and
cooling technology in the past 10 years. HP continues to address power
efficiency issues across the data center by introducing new technology solutions
to meet the needs of its customers, particularly those building next-generation
data centers. Customers today benefit from HP Thermal Logic featuring HP Active
Cool Fans and Dynamic Power Saver, HP Dynamic Smart Cooling, HP Modular Cooling
System, HP Power Regulator and HP Insight Power Manager.
Energy efficiency has been a key aspect of HP’s environmental strategy since
1992. The company offers a full range of energy-efficient products and
enterprise solutions that help customers save money while reducing environmental
The full version of the Sine Nomine study is available at www.hp.com/go/bladepowerreport.
More information on HP power and cooling technologies for businesses is
available at www.hp.com/go/powerandcooling.
More information on Sine Nomine is available at www.sinenomine.net.