FrostyTech.com Heatsink Reviews and Analysis
      
TOP 5 Heat Sinks     TOP 5 Low Profile Heat Sinks     TOP 5 Liquid Coolers    
 Reviews + Articless     News     HSF Mfg's Index     Advanced Search    
Soliton R&D Corp Kapton Polymide Ribbon Capillary CPU Liquid Cooling - FrostyTech.com Soliton R&D Corp Kapton Polymide Ribbon Capillary CPU Liquid Cooling
Mon Jul 23, 2007 | 4:19A| PermaLink
Nikkei Electronics Asia reports on a Kapton Polymide ribbon capillary CPU liquid cooling system by Soliton R&D Corp of Japan. ; "A new type of water-cooling technology has appeared to handle IC heating issues in PCs and other equipment. Compared to existing water-cooling modules it seems to offer better heat radiation performance, smaller and lighter specs, and cheaper manufacturing. The new technology is under development by Soliton R&D Corp of Japan, a technology start-up involved in R&D of flexible circuit boards. The basic approach is to form an extremely fine network of channels through Cu foil, passing the water or other cooling medium. Eventually the firm hopes to form it as an integral part of the printed circuit board (PCB) or flexible circuit.

The firm commented that the prototype is already capable of cooling the surface temperature of a 150W IC low enough for normal operation. One of the reasons that Soliton's design achieves such high cooling performance is that it uses fine pipes - or capillaries. The total surface area can be maximized in comparison to the coolant volume, boosting performance. For example, the A4-size Cu sheet used as the radiator has a large number of capillaries running parallel, with a length of over 3 meters each for a total path length of 30 meters. The capillaries are 1.5mm in width, and 150µm deep. Both dimensions were based on the performance of the existing pump, and will be reduced to about 50µm square in future designs. These numbers are on a par with the "microchannel" design under development by Intel and others for microprocessor cooling.

A smaller capillary cross-section means that the Cu sheet can be made thinner, which is the key to smaller and lighter modules. The Cu sheet used in the prototype was 0.4mm thick, but Soliton expects to be able to reduce this to 70µm. At 0.4mm, the A4-size Cu sheet weighs over 200g, but this would be reduced to under 40g if only 70µm thick."

FULL STORY @ NIKKEIBP
(http://techon.nikkeibp.co.jp/article/HONSHI/20061116/123804/)


News Archives by Category
» Audio / Sound » Beginners Guides » Benchmarks
» Biometrics » BIOS » Business / Industry
» Cases » Chipset » Computer / SFF PCs
» Cooling / Heatsinks » CPU / Processors » Digital Cameras
» Drivers » Editorial » Games
» Gossip » Hard Drives/SSD » Hardware
» Home Theatre » Imaging » Memory
» Mobile Devices » Monitors » Motherboards
» Mouse Pads » MP3 Players » Networking
» Notebooks » Operating System » Optical Drives
» Overclocking » Peripherals » Power Supply
» Press Release » Printers » Servers
» Site News » Software » Tips
» Tradeshows / Events » Video Cards » Web News
Follow Frostytech on FacebookFrostytech News RSS FeedFollow frostytech on Twitter
Resources
° Got Feedback?
° Mk.II Test Platform
° Where To Buy?
° Manufacturer Index
° Industry Dir.
° Cooling Projects

Scythe Ninja 4 SCNH-4000 Heatsink Review

DeepCool Maelstrom 240 Liquid Cooling System Review

DeepCool Gamer Storm Lucifer K2 Heatsink Review

Gelid Antarctica Heatsink Review

Noctua NH-D9L 3U Low Noise Heatsink Review

BeQuiet Shadow Rock LP Heatsink Review
...More Articles >>




Websites you may also like:
PCSTATS

Google Search Frostytech

Time stamped: 5:00AM, 12.15.2017
In Case You Missed it...
°  Arctic BioniX F120 and F140 fans review

°  be quiet! Dark Base Pro 900 Case Review

°  Cooling fan maker Power Logic scheduled for listing

°  Antec Mercury 120 Review

°  Zalman Z-Machine X7 Full Tower Case Review

°  Noctua NH-U12S SE-AM4 CPU Cooler Review




FrostyTech.com
Since June 1999


Find a Heatsink / RSS Feeds
Latest Heatsink Reviews
Top 5 Heatsinks Tested
News RSS Feed
Reviews RSS Feed


Social Media
Facebook
Twitter
Pinterest


FrostyTech.com Info
Feedback
Contact Us / Heatsink Submissions
Submit News
Legal
Suite 66
© Copyright 1999-2017 www.frostytech.com All Rights Reserved. Privacy policy and Terms of Use
Images © FrostyTech.com and may not be reproduced without express written permission.
Current students and faculty of accredited Universities may use Frostytech images in research papers and thesis, provided each image is attributed.