Zalman has introduced the TNN 300A noiseless microATX case which takes up a bit less space than its TNN 500A cousin, but still operates silently.
"Heat from the CPU is transferred to the heatsink plate through 6 heatpipes each 6 millimeters in diameter and a combined heat transfer capacity of 150 watts. The CPU Block Base is made of pure copper to ensure the highest cooling performance. Heat from the VGA Card is transferred to the heatsink plate through 3 heatpipes each 6 millimeters in diameter and a combined heat transfer capacity of 75 watts. Large aluminum heatsink plates silently cool heat generating components, such as the CPU, VGA Chipset, and PSU through natural convection. It is virtually free of the need for mechanical maintenance, and is 100% recyclable."
"When the Rear-mount Thermal Blocks are installed on the back-side of the motherboard in line with the position of the FETs (Field Effect Transistor) and the Northbridge chipset, each can lower the FET temperature by 10 to 30°C (50 to 86°F) and the Northbridge chipset by 5 to 10°C (41 to 50°F)."
"Heat from the power supply is transferred directly to the high-capacity heatsink plates, where it is dissipated by natural convection, making the power supply free of noise and vibration. The power supply uses high-efficiency FET components and Heat Source Contact (HSC) technology, eliminating the need for a fan, and has a 10% higher power conversion efficiency (80%) rating than conventional power supplies."