FrostyTech.com Heatsink Reviews and Analysis
> GO < Search
TOP 5 BEST Heat Sinks     SEARCH     News     Reviews    
Follow Frostytech on FacebookFrostytech News RSS FeedFollow frostytech on Twitter
° Reviews and Articles
° Breaking News
° Mfg's Index
° Top 5 Heatsinks
° Top 5 Liquid Cooling
° Top 5 Low Profile   Heatsinks

Top 5 Heatsink Charts


NoFan Computer
What's New in Heatsinks?
°  SilverStone Tundra TD03-E CPU Liquid Cooler Review

°  Corsair H100i GTX Liquid CPU Cooler

°  Noctua NH-L9x65 CPU Cooler Review – Compact and Quiet

°  Fractal Design Venturi HP-12 PWM and HP-14 PWM Cooling Fans

°  Zalman Z11 NEO Case Review

°  Thermalright TRUE Spirit 140 BW Rev.A CPU Cooler Review


   - or - Best 5 Heatsinks?
VIA striking deeper - FrostyTech.com VIA striking deeper
Thu Mar 22, 2001 | 6:50P| PermaLink
TAIPEI, Taiwan - Hoping to strike deeper into the CPU market, Via Technologies will officially unveil its second generation microprocessor at two upcoming conferences - CeBit (Hannover, Germany) March 25 and WinHEC (Anaheim, Calif.) March 26. And based on tests claiming that it performs equitably against Intel's Celeron on commonly used 2D applications, the company believes it can win 5 to 7 percent market share this year.To reach such an ambitious goal, Via is sinking deeper roots into emerging markets like China and India, where it hopes to exploit cracks in the global strategies of Intel and Advanced Micro Devices. Key to its plans will be pushing Information PC designs that bundle the Via Cyrix III, based on the new Samuel 2 core, with the Via Apollo PLE133 chip set and its integrated AGP 3D/2D graphics core. The new Samuel 2 core is the scrappy Taiwanese company's effort to arm itself anew to do battle for the low end of the PC market with Intel and AMD. The 1.5-volt, 750-MHz chip will be quickly followed by an 850-MHz version. Both will be made with a 0.15-micron process, use a 133-MHz front-side bus and feature 64 kbytes of L2 cache, which the company says will boost performance by 10 to 30 percent over its predecessor. The Samuel 2 is expected to ship in volume this summer and to have a footprint of 52 mm2. Around the same time, Via predicts it will have a 1-GHz version ready for sampling, which will be made with a 0.13-micron process.
FULL STORY @ EMAIL


News Archives by Category
» Audio / Sound » Beginners Guides » Benchmarks
» Biometrics » BIOS » Business / Industry
» Cases » Chipset » Computer / SFF PCs
» Cooling / Heatsinks » CPU / Processors » Digital Cameras
» Drivers » Editorial » Games
» Gossip » Hard Drives » Hardware
» Home Theatre » Imaging » Memory
» Mobile Devices » Monitors » Motherboards
» Mouse Pads » MP3 Players » Networking
» Notebooks » Operating System » Optical Drives
» Overclocking » Peripherals » Power Supply
» Press Release » Printers » Servers
» Site News » Software » Tips
» Tradeshows / Events » Video Cards » Web News
Resources
° Got Feedback?
° Mk.II Test Platform
° Where To Buy?
° Manufacturer Index
° Industry Dir.
° Cooling Projects

BeQuiet Pure Rock Heatsink Review

DeepCool Gamer Storm Lucifer Heatsink Review

Raijintek Tisis Dual-Tower Heatsink Review

Reeven Okeanos RC-1402 Heatsink Review

Reeven Justice RC-1204 Heatsink Review

Reeven Ouranos RC-1401 Heatsink Review
...More Articles >>

 

Websites you may also like:
PCSTATS

Google Search Frostytech

Time stamped: 1:35AM, 05.07.2015



FrostyTech.com
Since June 1999

Find a Heatsink / RSS Feeds
Latest Heatsink Reviews
Top 5 Heatsinks Tested
News RSS Feed
Reviews RSS Feed


Social Media
Facebook Fan Page
Twitter
Pinterest


FrostyTech.com Info
Feedback
Contact Us / Heatsink Submissions
Submit News
Legal

Contact the Suite 66 Advertising Agency
© Copyright 1999-2015 www.frostytech.com. All Rights Reserved. Privacy policy and Terms of Use
Images © FrostyTech.com and may not be reproduced without express written permission.