"Using Coolit, engineers manipulated base thickness, fin geometry, airflow and the balance among these parameters in the search for the optimum configuration. Four custom heat sink designs were evaluated in only two days. The result was a patent-applied-for design in which pin width and thickness vary to compensate for losses in cooling capacity as air slows down and warms up during its heat sink traverse. In addition, the pins are aligned in rows, unlike conventional designs where they are staggered like bowling pins.
At the leading edge of the heat sink where airflow is maximum, smaller pins deliver the required heat dissipation. The smaller pins also reduce the likelihood of creating an air dam that would reduce downstream cooling. As air moves across the heat sink, its velocity decreases and the pin surface area is increased to compensate.
The unorthodox design shaves 15 deg. C off processor die temperature and cuts the per-piece cost by over 80%."