The German website, PCGames.de show us pictures of the Matrox Parhelia core
today - the metal topped BGA chip looks like it will be an improvement on the
packaging formfactors used by companies like ATI and Nvidia. I've seen a few
system-on-a-chip processors which utilize this same manner of packaging and the properties
were a bit better in terms of heatsink/chip interface.
One big downside I can see already is the reliance on just two
off-set mounting holes. The four centered holes around the Geforce 4 (plus
diagonal mounting holes) give you a lot more to work with.