"The 735 was developed from the ground up to be a single chip solution by gluing the North and South bridge together. The obvious upside to this is an extremely large amount of bandwidth between the two. While VIA's V-Link technology offers around 600 MB/s transfers, the integrated SiS solution is in the neighborhood of 1.2 GB/s. (Of course 600 MB/s is more than enough speed and the 1.2 GB/s is just overkill.) This is all thanks to SiS's Multi-threaded I/O Link technology which allows the chip to communicate with multiple devices much more effectively."
FULL STORY @ IANAG (http://www.ianag.com/cgi-bin/reviews.cgi?name=k7s5a&p=1)