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DON'T DO THIS!!!!
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| Tue Aug 01, 2000 | 12:36P| PermaLink |
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READ THIS: VERY IMPORTANT!!! This has to be the worst example of what should NEVER be lapped, and absolutly how NOT to go about it. Coppermine processors have the silicon core exposed. For the purposes of etching the chips, these cores are already very, very flat and smooth. Secondly, the article illustrates lapping on a wood table, with cracked paint. Lapping should be done on very hard and very smooth surfaces, like thick metal or granite, or glass. Lastly, unless you intend to attach an alpha, the heatsink will have more flaws then the CPU, negating the entire process.
"*Lapping: It basically means that you sand the plastic sealant that is over the top of the CPU core as much as possible without exposing the CPU core. The lesser the sealant between the CPU core and the heatsink, theoretically speaking, would increase the heat dissipation effectiveness of the heatsink and the CPU core."
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FULL STORY @
OCWORKBENCH
(http://www.ocworkbench.com/articles/lapping/lappingp1.htm)
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