Digitimes reports some good news for thermal solutions manufacturers in Taiwan; "Taiwan's cooling module suppliers are set for robust growth in 2020 and beyond driven by demand for heatpipe- or vapor chamber (VC)-based heat dissipation solutions from the smartphone sector, according to industry sources.
The ratio of smartphones available with heatpipe or VC cooling solutions will reach only 5% in 2019, and the ratio is expected to climb to 15-20% in 2020, 35-40% in 2021 and to over 50% in 2022, said the sources.
Digitimes Research has estimated that global smartphone shipments will increase from 1.37 billion units in 2019 to 1.417 billion in 2020, 1.47 billion in 2021 and to 1.523 billion units in 2022.
Having used heatpipe solutions for all of its smartphone lineups for years, Samsung Electronics has also begun to utilize VC-based cooling modules for some of its models since two years ago, pushing forward the applications of copper heat dissipation solutions, noted the sources.
The growing adoption of heatpipe- and VC-based cooling solutions will further consolidate the leading market position of Taiwan-based heat sink module producers, including Chaun Choung Technology (CCI), Auras Technology, Taisol Electronics, Asia Vital Components (AVC) and Delta Electronics, said the sources, adding that Taiwan's makers together currently account for over 90% of the global cooling module market.
Besides, the availability of 5G smartphones will further drive up demand for highly-efficient cooling solutions as 5G models are likely to be required to dissipate 9 watts of heat they generate when in use compared to 5-6 wats of 4G models, indicated the sources.
If high-speed data transmission and multi-task operations are taking into account, the heat dissipation capability of 5G smartphones may need to be upgraded to 10-15 wats, and that will boost the business prospects for cooling module vendors in coming years, added the sources."