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Two-Phase Thermal Ground Planes
Tue Jul 17, 2018 | 10:34P | PermaLink BY: Max Page
ASME.org have an interesting paper entitled "Two-Phase Thermal Ground Planes: Technology Development and Parametric Results" which covers DARPA's research into thermal ground planes combining the advantages of vapor chambers and solid conductors by building thin, high effective thermal conductivity, flat heat pipes out of materials with thermal expansion coefficients that match current electronic devices.

In particular, these Teledyne TGP biwick structures caught our eye:

www.frostytech.com

www.frostytech.com

www.frostytech.com

"The advantages of CNT biwick structures are that the large pores provide low viscous flow facilitating vapor escape during nucleate boiling while the small pores enhance thin film evaporation. "

FULL STORY @ ASME.ORG
(http://electronicpackaging.asmedigitalcollection.asme.org/article.aspx?articleID=2457405)

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Time stamped: 1:54PM, 04.22.2019
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