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KULR carbon fiber-based thermal interface material
Sat Nov 25, 2017 | 5:53P | PermaLink BY: Max Page

The majority of thermal interface materials used between a heatsink and CPU fall into one of two camps; oxide/nitride-based pastes or soft metal foils with high thermal conductivity that conform to the two mating surfaces (think Indium).

KULR Technology on the other hand offer a new and very unique, carbon fiber-based thermal interface material (FTI). The Fiber based Thermal Interface reportedly has a high bulk thermal conductivity up to 90W/mK, low thermal resistance at below 0.10°C in2/W and requires a little has 5psi contact pressure (20psi for full performance). While paste thermal compounds are applied as thin as possible, the KULR FTI material can be applied in thicknesses up to 1mm.

What does KULR's carbon fiber-based thermal interface material look like?

www.frostytech.com

It looks like fuzz.

 

 

FULL STORY @ KULR TECHNOLOGY
(http://www.kulrtechnology.com/thermal-interface-material)

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Time stamped: 12:45AM, 10.23.2018
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