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Cooling module makers to further reduce mobile device heat pipe thickness - Cooling module makers to further reduce mobile device heat pipe thickness
Wed Apr 23, 2014 | 5:33P | PermaLink BY: Max Page
Digitimes reports: "Cooling module makers such as Japan-based Furukawa Electric Group and Fujikura and Taiwan-based Chaun-Choung Technology and Taisol Electronics, are looking to reduce the thickness of their existing 0.6mm heat pipes for smart mobile devices by 25% and the new heat pipe is expected to enjoy a penetration rate of over 15% in the smart mobile device market with orders from tablets and smartphones, according to sources from the upstream supply chain.

The sources pointed out that heat pipes are made by copper and need enough thickness to maintain their shape. They started mass producing 0.8mm heat pipes in 2013 and will start mass productions of 0.6mm one in 2014.

Microsoft's upcoming Surface 3 tablet adopts a 0.6mm heat pipe for cooling, while Sony's Xperia Z2 has adopted ultra-thin heat pipes from Furukawa and Fujikura.

CCI has already started shipping its 0.6mm heat pipes and expects 0.6mm-0.8mm models to become the mainstream cooling modules for mobile devices in 2014. CCI's monthly capacity is expected to reach 1.5-2 million units by the end of May.

CCI pointed out that global heat pipe shipments were about 50 million units in 2013 with 0.8mm models accounting for 10 million units. In 2014, 0.6mm models will take over 0.8mm models' position and also have a chance to reach 10 million units, accounting for 16% of global annual shipments of 60 million units."


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