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CoolingZONE 2013 Thermal Management Summit
Thu Aug 01, 2013 | 7:22P | PermaLink BY: Max Page
www.frostytech.com

The CoolingZONE 2013 Thermal Management Summit is happening the 21st-23rd of October 2013 at the Granite Links Golf Course and Conference Center, Boston, MA. If you are a thermal engineer or work designing heatsinks this may be right up your alley and a good chance to learn something new and meet with industry peers. CoolingZone are offering a 15% registration discount for Frostytech readers. The discount code is CZ2013-MSPS41 and it's valid until September 21st.

Here's what you need to know about this thermal solution summit:
"CoolingZONE's 2013 Thermal Management Summit will feature expert speakers in thermal management, electronics cooling, energy transport and heat transfer. It is ideal for all engineers engaged in dealing with the various thermal challenges in the design of electronics. The summit will offer participants:
•Opportunities to learn about the upcoming challenges in thermal management - see what is coming so you can be prepared.
•Learn about new technologies being developed and brought to market to meet the future cooling requirements.
•Opportunities to gain a valuable and extensive network of contacts to serve as an excellent source of advice and technical knowledge.
•In depth conversations with leading experts in the field.
•The complete speaking agenda is posted here.
You can see the Summit web site here. Registration for coolingZONE-13 is $995.00 per person attending. Use the discount code we mentioned earlier in this post to get 15% off the attendance price for readers of FrostyTech.

Some of the Keynote highlights include
"Galinstan-Based Liquid Cooling of Microelectronics" by Marc Hodes, Ph.D., Associate Professor, Department of Mechanical Engineering Tufts University.

“High Performance, Energy Efficient Oblique Fin Liquid Cooling Technology for the Effective Thermal Management of EV/HEV Battery Pack and Power Electronics” by PS Lee, Ph.D., CEO, GCore Labs.

"Advances in Miniaturized Vapor Compression Electronics Cooling" by Jim Burnett, Director, Government Business Development, Aspen Systems.

"The Commercial Use of Diamond Heat Spreader Material for Thermal Management/Heat Transfer Challenges" by Bill Pfeifer, Director of Sales, sp3 Diamond

"Driving Towards 0.1 Degree C per Watt in Compact Air Cooled Systems: Advancements in Flow Management and Air Jet Impingement Cooling" by Camil Ghiu, Ph.D, Member of Technical Staff III-Researcher, Advanced Thermal Solutions, Inc.

FULL STORY @ COOLINGZONE
(http://www.coolingzone.com/event.php?eventid=41)

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