Though it's now been delayed nearly a year, we're pleased to say the last critical component for Frostytech's 200W Intel LGA2011 thermal test platform has finally materialized! What this means is you'll shortly see a flood of self-contained liquid cooling systems reviewed at a heat load which makes them sweat!
Given recent claims of "300W heat capacity" by some heatsink manufacturers I'll admit we were tempted to increase our test capacity to challenge those assertions... However, seeing as flagship CPUs from Intel and AMD have typical Thermal Design Power (TDP) capped off in the 130W-150W range, there's hardly a need, even with overclocking.
Although Frostytech's latest synthetic platform is designed around the 80x80mm Intel LGA2011 mounting system, the 38x38mm Integrated Heat Spreader (IHS) of this class of processor almost exactly matches the IHS dimensions of AMDs chips. In other words, AMD users will also get a sense of how CPU coolers for AMD FX processors handle at elevated heat loads. :-)