Rise Above Ambient Temp. (c)
	Mfg.	Model	27mm large copper block	15mm small copper block		27mm large copper block	15mm small copper block
			50W	50W		100W	100W
1	Thermal Integration	TI-V77L	12.6	17.9		31.0	37.1
2	Vantec	CCK-6027D	18.0	22.2		37.5	46.0
3	OCZ	Dominator	11.2	24.4		25.9	47.7
4	Akasa	Silver Mountain	19.6	24.9		38.4	49.5
5	Vantec	CCK-6035D-Retail	17.7	26.3		36.7	51.4
6	Thermaltake	Volcano 6cu+	13.8	28.8		32.1	57.9
7	Spire	5T060B1H3R	16.0	30.8		37.9	58.4
8	Fortis	A92	18.9	39.1		41.1	71.1
			50W	50W		100W	100W

Thermal adhesive, no matter how good it is cannot be considered a replacement for a solid metal joint, or even soldering job. From the tests we can see one that the Fortis A92 is overwhelmed by 100W heat load. Thick aluminum fins joined to a copper base with what appears to be thermal epoxy really doesn't have the needed kick it should. Were the interface between the aluminum fins and copper base more conductive we might see the A92 come back fighting better.

While it has a high speed fan, the thick fins and non-optimal joint between the base plate leave it lacking on the small interface die tests. Given the limitations of the technology being applied here we have to class this heatsink as OEM, and as such it is not ideal for performance cooling situations on processors like the T-bird. On the larger interface die the performance (especially at 50W) is pretty good, but at higher wattage's it can keep up.