All things considered the Neng Tyi K612 faired only average on the large copper die template, and faired poorly with the small copper die template. The thermaltake came in first and the ThermalBuster second in this reference test.

The poor results of this test with the K612 are due mainly to its small size. No matter that the base of the K612 is copper, the surface area of the fins is simply too small to dissipate high amounts of heat with FC-PGA grade processors. This heatsink would probably do well in situations where space is at a premium, and heat generation is under 50W. For high heat generating situations, it just doesn't perform well enough for use in a performance system. The temperatures are of course kept well-within the specs of even a PIII, but with a slightly larger heatsink, several degrees of improved performance can be had.

The results of the Rise Above Ambient Temperatures reiterate what we saw just a second ago. The K612 is the smallest of all the heatsinks referenced, and naturally falls just below the performance curve. The only mitigating factor would be a situation where you were really constrained for space above a processor, or maybe modified slightly for a GPU....

Conclusion:

For systems which are seriously choked for space this cooler is an obvious choice.

We really like the large thumb clip and found attaching the heatsink simple, and without fears of snapping the chip in two.

While it does manage to integrate a copper base and aluminum fin design into a small space, it just can't win with the laws of physics. There simply isn't enough surface area for the amount of air being pumped over the fins for this heatsink to be classed as a high-performance cooling option. Possibly with a larger fan it would be able to hold its's own, but right out of the box it just lacks the size physically required to do the job.