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AOS Non-Silicon Thermal Compound Review
AOS Non-Silicon Thermal Compound Review
Abstract: A majot part of every overclockers' toolkit should be a nice assortment of thermal pastes. For most of us, those little packs that come with better heatsinks make up our collection of pastes.

 Company link  Category  Published  Author 
AOS   Cooling / Heatsinks   Sep 25, 2000   Max Page  
Home > Reviews > Page Title: Final Results

The contenders on the side of silicon based thermal compounds were Type Z9 and Type 120 generic goo's.

Both the Wakefield and GC Electronics thermal compounds are pretty generic. They performed fairly well, though I don't have their thermal conductivity's to compare with the AOS stuff. When we had the CopperSink on the test platform with no thermal compound at all, the internal thermistor went off the scale which was +70 C. A little thermal compound brought about a +10 C drop in temperature, with the HTC-60 exhibiting a drop of +14 C.

On average the non-silicon thermal compounds performed better than the silicon variety, except for the 52029KY batch. It was very strange to see it actually perform worse than 52022,  and it did appear to be very thin, so perhaps it was a bad batch. Either way, the HTC-60 is the clear winner in terms of the AOC non-silicon thermal compounds. It's resistance to drying out is a major plus, but its mild abrasiveness is not to great for bare silicon. Use sparingly if you try it out, and hope it doesn't abrade the die too much.

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Table of Contents:

 1:  AOS Non-Silicon Thermal Compound Review
 2:  The Three Goo's
 3: — Final Results

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