FrostyTech.com Heatsink Reviews and Analysis
      
TOP 5 Heat Sinks     TOP 5 Low Profile Heat Sinks     TOP 5 Liquid Coolers    
 Reviews + Articless     News     HSF Mfg's Index     Advanced Search    

Cryo Tech and New Cooling Technologies You Have Never Seen
Cryo Tech and New Cooling Technologies You Have Never Seen
  0%   
Abstract: Frostytech departs from the usual pixel fodder for a brief look at some cooling technologies you have never seen before. We touch on some fun tests from the unpublished Frostytech archives and collect all the thermodynamics research we've reported on into one location.

 Company link  Category  Published  Author 
Frostytech.com   Cooling / Heatsinks   May 27, 2010   Max Page  
Home > Reviews > Page Title: Annex C) Heat Exchangers, Microchannel, Capilliary, Spray Watercooling

IBM Develop High Thermal Conductivity Interface Technology:

The IBM Zurich Research Laboratory has developed a technique, called "high thermal conductivity interface technology," which allows a twofold improvement in heat removal over current methods. This paves the way for continued development of creative electronic products through the use of more powerful chips without complex and costly systems simply to cool them.
FrostyTech.com

The approach used by IBM addresses the connection point between the hot chip and the various cooling components used today to draw the heat away, including heat sinks. Special particle-filled viscous pastes are typically applied to this interface to guarantee that chips can expand and contract owing to the thermal cycling. This paste is kept as thin as possible in order to transport heat from chip to the cooling components efficiently. Using sophisticated micro-technology, the IBM researchers developed a chip cap with a network of tree-like branched channels on its surface. The pattern is designed such that when pressure is applied, the paste spreads much more evenly and the pressure remains uniform across the chip. This allows the right uniformity to be obtained with nearly two times less pressure, and a ten times better heat transport through the interface.

FrostyTech.com

FrostyTech.com

Looking beyond the limits of air-cooling systems, Zurich researchers are taking their concept of branched channel design even further and are developing a novel and promising approach for water-cooling. Called direct jet impingement, it squirts water onto the back of the chip and pulls it off again in a perfectly closed system using an array of up to 50,000 tiny nozzles and a complicated tree-like branched return architecture. By developing a perfectly closed system, there is also no fear of coolant getting into the electronics on the chips. The team has demonstrated cooling power densities of up to 370 Watts per square centimeter with water as coolant."

High Heat Flux Nuclear Waterblocks:

These are three high heat flux (10-20 MW/m2) copper waterblock test patterns for the International Thermonuclear Experimental Reactor. Boeing apparently produced these channels with the goal of incorporating complex coolant channels by close tolerance machining to create thin webs or slots. These webs and slots are 1-1.5 mm wide and 4-6 mm tall or deep. Although some of the detail parameters are proprietary, the general design of the coolant channel shows potential for processor cooling applications.

Thin Film Heat Exchanger :

"The dimensions of MCFs are ideally suited for heat transfer applications. Due to the small size of the capillaries, the main resistance to heat transfer is not from the plastic that the film is made from, but the heat transfer properties of the laminar flow within the capillaries. This means that, in spite of their plastic construction, the performance of MCF micro heat exchangers is comparable to those made of copper where the thermal conductivity of the base material is over 2000 times greater.

The flexible nature of MCFs combined with their excellent heat transfer properties have led to proof of concept experiments with CPU cooling and also the evaluation of MCFs in the construction of sports therapy devices."

CHENG: "The image above shows the prototype CPU cooler attached to an old AMD 166MHz CPU. With water at room temperature flowing through the film at a rate of 40ml/min, the chip was held several degrees cooler than with the conventional heatsink and fan arrangement. With neither the fan nor the MCF cooler, the CPU would overheat within two minutes."

IBM Cools 3-D Processors with H2O:

"IBM scientists unveiled a powerful and efficient technique to cool 3-D chip stacks with water. In collaboration with the Fraunhofer Institute in Berlin, they demonstrated a prototype that integrates the cooling system into a 3-D chip by piping water directly between each layer in the stack.

www.frostytech.com
These so-called 3-D chip stacks—in which chips and memory devices that traditionally sit side-by-side on a silicon wafer are layered on top of one another—presents one of the most promising approaches to enhancing chip performance beyond its predicted limits.
www.frostytech.com
This follows IBM's leadership in advancing chip-stacking technology in a manufacturing environment announced one year ago, which drastically shortens the distance that information needs to travel on a chip to just 1/1000th of that on 2-D chips and allows the addition of up to 100 times more channels, or pathways, for that information to flow. Using the superior thermophysical qualities of water, scientists were able to demonstrate a cooling performance of up to 180 W/cm2 per layer for a stack with a typical footprint of 4 cm2. "This truly constitutes a breakthrough. With classic backside cooling, the stacking of two or more high-power density logic layers would be impossible," states Bruno Michel, manager of the chip cooling research efforts at the IBM Zurich Lab.
www.frostytech.com
To assemble the individual layers, Brunschwiler with colleagues from the Fraunhofer Institute developed a sophisticated thin-film soldering technique. Using this technique, scientists achieved the high quality, precision and robustness needed to ensure excellent thermal contacts as well as electrical contacts without shorts. In the final setup, the assembled stack is placed in a silicon cooling container resembling a miniature basin. The water is pumped into the container from one side and flows between the individual chip layers before exiting at the other side. Using simulations, scientists extrapolated the experimental results of their test vehicle to a 4-cm2 chip stack and achieved a cooling performance of 180 W/cm2."



 Previous Page °
° Next Page 

Table of Contents:

 1:  Cryo Tech and New Cooling Technologies You Have Never Seen
 2:  Thermoacoustic Cooling
 3:  Phase Change Waterchilling
 4:  Conduction PCB Cooling via Cold Plate Heat Exchangers
 5:  The Stirling Cycle Cryo Cooler
 6:  Annex. A) Graphite, Carbon Foam/Fiber, Polymer Heatsinks
 7:  Annex A) Graphite, Carbon Foam/Fiber, Polymer Heatsinks
 8:  Annex B) Diamond, Nano-structure and Metal Foam Heatsinks
 9:  Annex B) Diamond, Nano-structure and Metal Foam Heatsinks
 10:  Annex C) Heat Exchangers, Microchannel, Capilliary, Spray Watercooling
 11:  Annex C) Heat Exchangers, Microchannel, Capilliary, Spray Watercooling
 12: — Annex C) Heat Exchangers, Microchannel, Capilliary, Spray Watercooling
 13:  Annex D) Computational Fluid Dynamics and Innovative Heatsink Tech

List all Frostytech.com heat sinks that Frostytech tested?

Follow Frostytech on FacebookFrostytech News RSS FeedFollow frostytech on Twitter
Resources
° Got Feedback?
° Mk.II Test Platform
° Where To Buy?
° Manufacturer Index
° Industry Dir.
° Cooling Projects

Gelid Tranquillo 4 Air Cooled Heatsink Review

Coolermaster Ergostand III Laptop Cooling Stand Review

Noctua NH-L9x65 Low Profile Heatsink Review

Noctua NH-D9DXi4-3U LGA2011 Xeon Server/Workstation Heatsink Review

Scythe Fuma SCFM-1000 Heatsink

Scythe Ninja 4 SCNH-4000 Heatsink Review
...More Articles >>




Websites you may also like:
PCSTATS

Google Search Frostytech

Time stamped: 12:47AM, 06.18.2019
In Case You Missed it...
°  Noctua NH-U12A cooler

°  Bitspower Leviathan XF 360 Radiator

°  Bitspower Leviathan SF 360 Radiator

°  Fractal Design Prisma AL-12 PWM Review

°  Fractal Design Prisma AL-12 RGB Fan Review

°  Akasa Turing Fanless Chassis for 8th Generation Intel NUC




FrostyTech.com
Since June 1999


Find a Heatsink / RSS Feeds
Latest Heatsink Reviews
Top 5 Heatsinks Tested
News RSS Feed
Reviews RSS Feed


Social Media
Facebook
Twitter
Pinterest


FrostyTech.com Info
Feedback
Contact Us / Heatsink Submissions
Submit News
Legal
Suite 66
© Copyright 1999-2019 www.frostytech.com All Rights Reserved. Privacy policy and Terms of Use
Images © FrostyTech.com and may not be reproduced without express written permission.
Current students and faculty of accredited Universities may use Frostytech images in research papers and thesis, provided each image is attributed.