Spire 5E34B3 Cu-Baseplate Heatsink Review
The Spire 5E34B3 is
one of the few heatsinks we have seen to have a copper plate mounted on the base
of it. The extruded aluminum portion of the heatsink is fairly large, and
seems to be well designed from the outset.
The confusing part may
come if you happen to be looking for this heatsink in a store, as it can be
under any one of a number of names. On the web, you'll be able to find this
heatsink located at the Speeze and Spire websites - the names of the parent
companies heatsink brands. The box for this cooler is labeled Jamitech, but it
can also be under Fanner Tech Co. All these names are the same company, and
for the purposes of clarity, we will be calling this heatsink by its Spire name
since this brand is familiar to us here.
AMD Athlon, Duron. Intel FC-PGA, PGA.
VIA Cyrix III.
Fan: FTC FD06015B1M
- Fan Spec: 4500RPM, 12V, 0.17A, ball
- HS Dim: 51x70x65mm
- HS Material: extruded
aluminum and copper plate
- Mfg by:
Fanner Tech Co.
- Cost: unknown
The copper base plate is 4mm thick and attached to the base of
the aluminum extrusion by two screws which hold it in place. The area between
the copper and aluminum is filled with a silicon-based thermal compound in an
effort to improve thermal conductivity. Were the Aluminum and copper to be
bonded in the same fashion as the alpha heatsinks there would undoubtedly be
less thermal resistance to cope with. Still it seems to be a fairly unique
solution to spreading the heat over a larger surface area.