Ascent AC300-4P Heatsink Review
Ascent makes
the kind of heatsinks you'll see sitting on a shelf at your local computer
store. This little guy, the AC300-4P caught our eye a
while ago on a recent parts hunting trip. The bonded aluminum fins and large fan made it look like an excellent cooling solution
for our overclocked PGA370 Celeron. Let's see how it really stacked up,
and more importantly how it works on FC-PGA chips...
Designed
for:
AMD K6-2 and Celeron
PGA processors. |
The Ascent AC300-4P
- Aluminum base with
22 folded aluminum fins bonded to the base.
- Innovative
60x60x15mm fan: 12V, 0.15A
- Dimensions: 47x53x60mm
|
The folded fin
aluminum heatsinks have been around in a few different variations, and
manufactured by companies such as RJYD for some time now.
One might think that the thin aluminum fins which form the backbone
of this heatsink would offer really superior cooling potential. After all heatsinks work best when
they can rapidly collect and remove heat to the surrounding environment. Right?
Well the thin fins certainly cool off
rather quickly, but the question on our minds was whether or not they collected
much of the heat from the 1/8" aluminum base. With only about 2mm of the
folded aluminum in contact with the base at each fold, chances were that the
heat might not be conducting very high up the fins.
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