The Thermal Transtech International Corp. nPowertek NPH 775-1 Socket 775 heatsink looks
deceptively simple at first glance; but at the heart of this Intel
cooler is a huge copper cylinder. The large copper column is not technically a
heatpipe as we know it, it's what TTIC call a "heat column." This column,
25mm in diameter and made from a hollow copper cylinder which is vacuum sealed,
has a chemical coating on the inside that works to the same effect as a wick in
a traditional heatpipe.
specifically at this heatsink, the heat column transfers heat from the processor
core vertically up to approximately 30 copper fins of 60x75mm in size. The 25mm diameter copper column
passes up through the center of each of the 0.2mm thick copper fins,
conducting heat to each in the process. A single 70mm fan blows air over all the
fins, and if you wish another fan can also be added on the opposite side too.
nPowertek's NPH 775-1 heatsink weighs in at 615 grams, making
it a pretty heavy candidate for Intel LGA775 processor cooling. The 18x80x80mm
looks a little timid for an open framed cooler of this size, but it seems
to get the job done without much fuss.
|nPowerTek NPH 775-1
|Manufacturer: Thermal Transtech Int'l Corp. /
|Model No.: TTIC NPH 775-1|
|Materials: copper fins,
copper heat column, aluminum fan support|
|Fan Mfg: Everflow R128018DM|
|Fan Spec: 3500PM, 12V, 0.25A|
|Fan Dim: 18x80x80mm|
|Heatsink & Fan Dim: 98x81x103mm |
|Weight: 615 grams|
|Includes: PCB support plate, mounting screws,
Compatible with Sockets: LGA775
|Est. Pricing: $25USD
fan support frame connects to the extruded aluminum base, and simply rests on the top of the
heatsink by the red cap. The base is designed to mount on socket 775
processors only, using the through-PCB holes and a rear motherboard support bracket which is
included with the cooler. Four spring tensioned metric screws hold the 615gram
heatsink firmly in place once it is installed.
According to this documentation
by QuTech , the heat
column used here is essentially an empty cylinder of copper which has been
internally coated with a thin "superconducting heat transfer medium." The copper
cylinder is sealed off at both ends, and inside is under a vacuum of
approximately 1 Torr.
no. 6,132,823 explains QuTech's process steps for producing the unit used
in the nPowertek NPH 775-1 heatsink, and it's entitled Superconducting Heat Transfer Medium.
Here is a short excerpt from the patent which explains the technology in plain
english... but feel free to skip ahead to the actual heatsink review.
"Inorganic Medium Thermal Conductive Device.
This heat conducting device greatly improved the heat conductive abilities of
materials over their conventional state. Experimentation has shown this device
capable of transferring heat along a sealed metal shell having a partial
vacuum therein at a rate of 5,000 meters per second.
On the internal wall of the shell is a coating applied in three steps
having a total optimum thickness of 0.012 to 0.013 millimeters. Of the total
weight of the coating, strontium comprises 1.25%, beryllium comprises 1.38%,
and sodium comprises 1.95%....
The fact that a conventional heat pipe shares a similar outside shape
to a thermal superconductive heat pipe used to raise some misunderstandings.
Therefore, it is necessary to give a brief description on the differences and
similarities of the two.
A convectional heat pipe makes use of the technique of liquids
vaporizing upon absorbing great amounts of heat and vapors cooling upon
emitting heat so as to bring the heat from the pipe's hot end to its cold end.
The axial heat conducting velocity of the heat pipe depends on the value of
the liquid's vaporization potent heat and the circulation speed between two
forms of liquid and vapor. The axial heat conducting velocity of the heat pipe
also is restrained by the type and quantity of the carrier material and the
temperatures and pressures at which the heat pipe operates (it can not be too
The present superconductive heat transfer device is made of a thermal
superconductive medium whose axial heat conduction is accomplished by the
thermal superconductive mediums' molecules high speed movement upon being
heated and activated. The present superconductive heat transfer device's heat
conducting velocity is much higher than that of any metal bars or any
convectional heat pipes of similar size, while its internal pressure is much
lower than that of any convectional heat pipe of the same temperature."
FrostyTech's heatsink test methodology is outlined in detail
here if you care to know what equipment is
used, and the parameters under which the tests are conducted. Now let's move
forward and take a closer look at this heatsink, its acoustic characteristics,
and of course it performance in the thermal tests!