This article is a follow-up to the 2004 issue which looked at all the latest heatsinks and
cooling systems from that period. Since this 2005 synopsis is mostly
an examination of heatsinks shot at recent trade shows, we'll jump right into the
mix. In the following pages we'll look at innovative heatsinks by
Thermalright, Thermal Integration, Aerocool, Coolermaster, Aopen, Asus,
Evercool, Foxconn, Gigabyte, Global Cooler, Glacialtech, Jetart, Kingcooler,
Lexsys, Thermaltake, Vantec, Zalman and a few others.
The first company on that list, recently showcased a variety of prototypes at
a recent trade show FrostyTech attended.
Thermal Integration have a released a
mix of really popular and completely unknown heatsinks since the companies
inception. At a recent trade show FrostyTech stopped by the booth and received a
guided tour of several new thermal solutions the company was preparing for
market. Everything we saw being demonstrated was remarkably well built and
designed. Unfortunately, most of the heatsinks were Pentium 4 LGA775 models, a
CPU which has not been very popular of late.

These photos of solid copper prototype heatsink
illustrate some of the technologies Thermal Integration was advancing at the
time. Notice how the stacked copper fins that circumvent the central copper
cylinder are all joined
together.
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| This prototype Thermal Integration Prescott-T FMB2 heatsink mounts a little
differently than expected, with the fan hovering several millimeters above
the actual heatsink. This model is multi-CPU
compatible. |
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| Thermal Integration's combination bifurcated fin
extruded heatsink with copper
core. |
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| This is a simpler K8 heatsink with a central copper core
used for moving heat towards the majority of the radially curved copper
fins. |
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| A Thermal Integration LGA775 heatsink with large copper
core to mount directly to the
CPU. |
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| A prototype heatsink apparently intended for the
LGA775 Pentium 4 processor. It appears as though a heat column is used at
the center instead of solid
copper. |