NengTyi K609 Heatsink Review
Originally developed for the socket
370 Celeron processor, the NengTyi K609 heatsink was ahead of its time. Built
with a fully copper base and thin aluminum fins, the heatsink was one of the first
to bridge the gap between all copper and all aluminum
Armed with a Nidec fan, the K609 was better
equipped than many other heatsinks of this class, but as time and thermal loads
have moved on, so to has the performance potential of this heatsink. What was
once a good heatsinks for socket 370 celeron's is now not so hot.... or on the
other hand, quite toasty. However, with a focus on low noise cooling systems and
processors like the C3 from VIA, there may still be applications where a
heatsink of this stature work well.
With aluminum fins and a copper base, just how well
will the NengTyi K609 perform thermally given the current set of thermal tests?
Let's find out!
Sold By: www.nengtyi.com.tw
- Model: K609
- Fan: 4700RPM, 13 CFM, 12V, Nidec Fan
- Fan Dim: 15x50x50mm
- Heatsink Dim: 40x58x52mm
- HS Material: Copper, aluminum
- Weight: 152 grams
|NengTyi K609 Heatsink
From All Angles|
||The Fan: |
Little 50mm fans have almost gone
the way of the dinosaurs because they
simply can't provide sufficient airflow for today's thermal requirements. In any case,
this Nidec BetaSL fan rotates at about 4700RPM and fits perfectly
on the small K609 heatsink. The fan connects to the motherboard via
a three-pin connector, and supports RPM monitoring.
fan removed for a moment we can see how this heatsink has been constructed.
The aluminum fins have been punched out of sheet metal, folded, and bonded together
with small tabs. The resulting assembly has been glued to the copper
base with an adhesive. There is virtually no clearance between the tips of
the fins and the base of the fan.
From a side we can see just how low the fin
this heatsink is -
with just 18 fins in total. Each aluminum fin is 0.4mm thick and
separated by 2mm of space from the adjacent fin. The cooling fins are 21mm in
height and the base is 3mm thick copper. The spring clip attaches to
just one of the socket tabs, but is at least
The base has is roughly finished from the stamping
process, and aside from a slight undercut is marked
with a few guidelines. The green thermal interface pad turns into a waxy substance once
heat is applied through the processor. The base is not smooth,
though it is generally flat over the area where the processor will come in contact
with the copper.