NengTyi P326 Copper Heatsink Review

Small heatsinks can be rather useful when it comes to assembling a lower-noise computer, but what about using a heatsink such as the NengTyi P326? While rummaging through our storage room in search of an ultra secret cooling solution we stumbled upon this heatsink from the days of the socket 370 Celeron processor. Not one to discount a heatsink just because it may be a little dusty, we pulled it out and got it ready for some testing.

With C3 processors on the market, and other applications which call for only marginal noise with cooling a heatsink such as this could be the perfect ticket for some systems - and perhaps if modified for very many more BGA applications.

Built on a thick copper base with aluminum fins, the NengTyi P326 may just have some life left in it for cooling, but to find out we're going to have to test it! So sit back and get ready to find out the answer to the question - can the P326 still cut it?

	Heatsink Specsheet: Model: P326 Fan: 4700RPM, 13 CFM, 12V, Nidec Fan Fan Dim: 15x50x50mm Heatsink Dim: 50x61x52mm HS Material: Copper Weight: 194 grams Sold By: www.nengtyi.com.tw

NengTyi P326 Heatsink From All Angles
	The Fan: Little 50mm fans don't move all that much air, but they do spin rather quietly which is a bonus. The P326 is equipped with a Nidec BetaSL fan which is higher quality that the norm. The fan connects to the motherboard via a three-pin connector, and supports RPM monitoring.
	Heatsink Top: With the fan removed we can see how this heatsink has been constructed. The thick aluminum fins have been punched out of sheet metal, folded, and bonded together with small interlocking tabs. The resulting assembly has been glued to the copper base with a thermal adhesive. There is about 4mm of clearance between the tips of the fins and the base of the fan.
	Side A: From a side we get a better idea of how the heatsink is assembled. There are 24 fins in total measuring 0.6mm thick and separated by 2mm of space. The copper fins are 30mm in height and the base is 3mm thick copper. The spring clip attaches to just one of the socket tabs, and requires a screwdriver to engage.
	Heatsink Base: The base has is roughly finished from the stamping process. The green thermal interface pad turns into a waxy substance once heat is applied through the processor. The base is not perfectly smooth, though it is generally flat over the area where the processor will come in contact with the copper.